China
Africa
Explore chapters and articles related to this topic
The Packaging Technologies for GaN HEMTs
Published in Hongyu Yu, Tianli Duan, Gallium Nitride Power Devices, 2017
Particularly, the quad-flat no-lead (QFN) package is a commonly used SMT package for power electronics. QFN is a quad-in-line SMT, which is usually based on a planar copper leadframe substrate. In a QFN package, an exposed thermal pad could facilitate the heat transfer, and the perimeter lands under the pad provide a good electrical connection to the PCB. Modified from a QFN package, International Rectifier launched an advanced power-packaging technology with better electrical characteristics and thermal performance and named it PQFN (see the front view of a typical PQFN package from International Rectifier and Infineon [35] in Fig. 9.5). In contrast to the common QFN package, the firm optimized the design of the leadframe and thermal management. In a PQFN package, a bare-die pad is introduced to reduce the thermal resistance between the die and the PCB. The PQFN package with a single pad is most popular, and it has been registered in the JEDEC now. For some special applications, multiple pads are also available. In addition, IR pushed another package type in power electronics, the DirectFET package, which is a dual-side-cooled packaging technology. As a variant type of PQFN, DirectFET can further eliminate unnecessary elements for lower inductance and resistance. Figure 9.6 shows a cross-sectional view of both PQFN and DirectFET. As the figure shows, the DirectFET package does not adopt any wire bonding and leadframe, in contrast to the PQFN package. Therefore, parasitic inductors are further reduced in the DirectFET package [36].
Package form factors and families
Published in Andrea Chen, Randy Hsiao-Yu Lo, Semiconductor Packaging, 2016
Andrea Chen, Randy Hsiao-Yu Lo
A quad flat no-lead (abbreviated as QFN) package is a plastic encapsulated lead-frame-based CSP with a lead pad on the bottom of the package to provide electrical interconnection with the printed circuit board. This package offers a small form factor with 60% size reduction compared with conventional QFP packages. It provides good electrical performance due to the short electrical path in the inner leads and wires. Electrical performance may be further enhanced by using a flip chip to shorten the interconnect path even further. The package also provides excellent thermal performance by an optional exposed die pad to provide an efficient heat path soldered on the circuit board. This small and light package with improved thermal and electrical performance makes QFNs suitable for portable communication and consumer products.
WiMAX Product Development Trends
Published in G. S. V. Radha Krishna Rao, G. Radhamani, WiMAX, 2007
G. S. V. Radha Krishna Rao, G. Radhamani
A new product, the M30001, is a highly integrated and performance-optimized WiMAX front end containing all active and passive components required to interface WiMAX transceivers directly to an antenna. Jacket Micro Devices (JMD) has announced it will begin sampling of the device, the market’s first complete mobile WiMAX RF front-end module [55]. The single 7 × 7 × 1.2 mm QFN package is seen as ideal for mobile phone, laptop, and consumer electronics applications. The small size of the M30001 allows WiMAX interfaces to be integrated along with other wireless and computing functions into small-form-factor products such as PCI Express, USB, and handsets. M30001 is scheduled for production release in Q2 2007, says the company. The M30001 provides exceptional attenuation in the UMTS transmit and receive bands, making it ideal for cellular environments. Meeting the need for extended range and increased data rates of WiMAX devices, the module delivers 24 dBm output power at 4 percent EVM. It is compatible with MIMO and antenna diversity configurations using a 1 × 2 architecture [56].
Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection
Published in Heat Transfer Engineering, 2018
Abderrahmane Baïri, Oriana Haddad, Jean-Pascal Guinart, Kemi Adeyeye, Nacim Alilat
The Quad Flat No-lead (QFN) electronic packages are used in many engineering fields given their electrical performance, small size and dimensions. They are often integrated into the electronic assemblies in different fields such as aeronautics, home automation (domotics), security and temperature control in modern buildings. Several works deal with various aspects relating to the QFN in order to improve their performance, reliability and integration in the assemblies [1–4]. The conductive thermal resistance of the materials composing these devices subjected to natural convection significantly affects their thermal state. Specifically, the characteristics of the resin used for their encapsulation play an important role. Its influence on the junction temperature of the QFN64 under the same operating conditions was quantified in a recent study [5]. The work shows that the increase of the conductive thermal resistance due to the decrease of the resin's conductivity significantly increases the junction temperature by about 31% when the average conductivity of the resin is reduced by 80%. Increasing the conductivity beyond the average value does not affect hardly the