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Interconnection technology
Published in Stephen Sangwine, Electronic Components and Technology, 2018
Solder is a low-melting-point alloy of tin and other metals, used for making electrical and mechanical joints between metals. Soldering does not melt the surfaces of the metals being joined, but adheres by dissolving into the solid surface. Figure 2.1 shows an idealized cross-section of a soldered joint illustrating this point. Soldered joints can be made by hand using an electrically heated soldering iron or by a mass-soldering process in which all the joints on a PCB are made in one automated operation. Both techniques are important, and they are described in detail below and in a later section of this chapter.
Metal Joining Techniques Using Brazing
Published in Yoseph Bar-Cohen, Advances in Manufacturing and Processing of Materials and Structures, 2018
Yoseph Bar-Cohen, Dusan P. Sekulic, Rui Pan, Sudarsanam Suresh Babu, Anming Hu, Denzel Bridges, Xiaoqi Bao, Mircea Badescu, Hyeong Jae Lee, Stewart Sherrit
Soldering is a process in which two or more metal/nonmetal parts are joined by melting and flowing a filler metal (solder) into the joint. As the convention, it is assumed that all such processes if they taking place at temperatures below 450°C, they should be called soldering. In any case, the filler metal has a lower melting point than the adjoined materials. Soldering is different from welding since it does not involve melting the base metals.
Second and Third Level Packaging Considerations for the use of Electronic Hardware at Elevated Temperatures
Published in F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak, High Temperature Electronics, 2018
F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak
High lead-content tin-containing solders offer a high operating temperature interconnect alternative. Although the composition is outside the eutectic, the two-phase temperature band is small. The high lead-content 95Pb-5Sn solder alloy has a melting point of 300°C. This alloy has found extensive use as a first-level solder interconnect for flip-chip applications joining chips to chip carriers. Other alloys similar to the 95Pb-5Sn alloy have similar properties, 95.5Pb-1 Sn-1.5Ag was developed to minimize intermetallic growth on silver metallizations, also has a high melting point of 309°C [Bader 1975]. These alloys consist of a matrix of large lead grains with small precipitates of tin in the bulk of the solder joint.
Design and prediction of healing assessment for AA2014-Nitinol strip-Solder alloy based hybrid self-healing composite structure via Taguchi analysis and fuzzy logic approach
Published in Mechanics of Advanced Materials and Structures, 2023
Vaibhav Srivastava, Manish Gupta
An aluminum alloy AA2014 is used as a matrix which has been reinforced with Ni-Ti (wt.% 55–45) based SMA (i.e. nitinol) strip of thickness of 1 mm and Sn45-Pb55 based solder alloy both as a healing agent to form a hybrid Metal Matrix Composites (MMC’s). The transition temperature of the phase transformation (i.e. Martensite to Austenite phase) for SMA strip is 70 °C. Whereas, the melting point of the solder alloy is 181 °C. The chemical composition of the AA2014 matrix confirmed through Energy Dispersion X-Ray (EDX) technique is shown in Table 1.