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Force-System Resultants and Equilibrium
Published in Richard C. Dorf, The Engineering Handbook, 2018
BGAs are considered a viable alternative to QFPs when lead counts exceed 200, or when placement issues of 0.65-mm0.025'' and smaller-pitch QFPs override inspection issues of BGAs. With their higher pitch, BGAs can typically be placed with standard SMT placement systems, requiring less X-Y accuracy than QFPs with their 0.65-mm0.025'' and 0.5-mm0.020'' pitches. Their biggest disadvantage is that only the outer ring of balls/pads can be inspected without x-ray, and there is no reliable way to “touch up” a solder joint. Most manufacturers recommend that any rework be accomplished by removal and replacement of the BGA package.
B
Published in Philip A. Laplante, Comprehensive Dictionary of Electrical Engineering, 2018
ball grid array (BGA) a modern high I/O count packaging method. It reduces the package size and its pin-to-pin trace gap in order to integrate more functions and reliability in a single space. It can have as many as 324 pins. BGA sockets are high speed, high reliability, surfacemountable, and can be installed without soldering. The related terms are PBGA--plastic ball grid array, CBGA--ceramic ball grid array, TBGA-- tape automated bonded ball grid array. The disadvantage of BGA packaging is that new tools and skills are required to mount or replace the chipset manually for repair purposes.
Package form factors and families
Published in Andrea Chen, Randy Hsiao-Yu Lo, Semiconductor Packaging, 2016
Andrea Chen, Randy Hsiao-Yu Lo
A BGA is a package technology that employs a solder ball grid array matrix to make electrical input and output connections to a printed circuit board. BGAs offers improved electrical and thermal operation through multiple routing layers such as ground and power planes. The package family includes cavity-up and cavity-down designs utilizing advanced substrate technologies, as well as optional heat spreaders and heat sinks when even higher thermal dissipation is a necessity.
Fatigue failure of pb-free electronic packages under random vibration loads
Published in International Journal for Computational Methods in Engineering Science and Mechanics, 2018
Saravanan S., Prabhu S., Muthukumar R., Gowtham Raj S., Arun Veerabagu S.
Electronic packages (IC Chips) can be mounted on Printed Circuit Boards (PCB) in many different ways. The most widely used method of mounting an electronic package on a PCB is the Surface Mount Technology (SMT). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than other packaging types. The whole bottom surface of the device can be used to provide solder joints in the form of an array. Most component failures in a severe vibration environment will be due to cracked solder joints, cracked seals, or broken electrical lead wires. These failures are usually due to dynamic stresses that develop because of relative motion between the electronic component body, the electrical lead wires, solder joints and the PCB. Most electronic equipments working in vibration environments are subjected to random vibrations rather than simple harmonic excitations. Random vibration differs from harmonic vibrations in that all the structural resonances of the electronic equipment within a given bandwidth will get excited at the same time. Hence, fatigue life prediction of solder joints under random vibration loads is one of the most important issues in understanding the solder joint reliability.