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Applied Power Device Family: Power Modules and Intelligent Power Modules
Published in Gourab Majumdar, Ikunori Takata, Power Devices for Efficient Energy Conversion, 2018
Gourab Majumdar, Ikunori Takata
Thepowermodulewasfirstcommercializedinthemid-1970s.Then, in the 1980s, the product family rapidly grew along with consensus building for energy saving. Generally speaking, a power module is formed by assembling several power chips and other passive/active components into a single housing or package. Its main use is power conversion and control. Before going into the details of power module features and functions, the following is a brief description about the power device family tree.
Intelligent Power Modules
Published in Dorin O. Neacsu, Switching Power Converters, 2017
Advantages of the IPM-type devices consist ofImproved reliability since the power semiconductor module could contribute better performance for the system’s reliability than individual components [19].Improved reliability since a power module provides a better thermal design and layout, both with effects on the system reliability. Using a power module supplied by manufacturer rather than multiple individual components is recommended for the inverter application [19].Two to three times better power cycling capability than using conventional power switches.Lower parasitic inductance than within the discrete solutions with benefits in voltage spike reduction, and possible operation at higher switching frequency with lower switching loss.Simplified power connection (VDC +, VDC−, A,B,C).Microcontroller connection through 6 logic-level inputs.Propagation delays for all low-side and high-side IGBTs are matched.Protection against over-current and over-temperature faults is secured.Reduction of system’s volume and weight.Easier debugging and field repair of the electronics equipment.
Dual space vector PWM technique for a three-phase to five-phase quasi Z-source direct matrix converter
Published in Automatika, 2022
S. Manivannan, N. Saravanakumar, K. N. Vijeyakumar
This module is available in the market as a single chip with five output pins. Among the five output pins, four pins are used to diode bridges, and one pin is used to IGBT gate drive circuit. Using the single control signal, the bidirectional current flow can be controlled by a single chip module. The QZSDMC consists of 27 bidirectional power switches among that 18 switches are effectively utilized. The spartan 3-A DSP controller and Xilinx XC3SD1800A FPGA are used to generate the control signals for bidirectional switching devices. The FPGA board consists of logic gates, A/D and D/A conversion processors, gate drive signal generator and modulation code processor. The FPGA board has the capability of handling the PWM signals up to 50. The entire power module circuit is protected using damping diode circuits.
Robust sensorless speed tracking controller for surface-mount permanent magnet synchronous motors subjected to uncertain load variations
Published in International Journal of Systems Science, 2020
L. T. Aguilar, R. Ramírez-Villalobos, A. Ferreira de Loza, L. N. Coria
The emulator platform consists of a motion control development kit based on a Delfino TMS320F28335 floating-point digital signal processor, manufactured by Technosoft. This evaluation platform is a real-time high-fidelity simulator for rotor position and speed of a brushless motor via digital-control configuration. The emulator system includes a motor equipped with Hall sensors and 500-line encoder, 3-phase inverter power module; besides it includes digital controllers, A/D and D/A converters and digital implementation aspects related to fixed point representation and computations (see TECHNOSOFT, 2012 for further details). The power module PM50 consists of a 3-phase inverter, the protection circuits and the measurement circuits for the DC-bus voltage and the motor currents. The power module employs MOSFET transistors with switching frequency up to 50kHz. The interface includes 6 PWM command inputs (TTL/CMOS compatible) through which the control unit can drive each transistor of the inverter, see TECHNOSOFT (2001) for further details.
Lattice-Boltzmann simulation of induced cavitation in protruding structure
Published in Numerical Heat Transfer, Part A: Applications, 2019
Zhixin Sun, Hongzhang Cao, Long Shan, Xuegong Hu
Due to the rapid development of electronic industry, heat dissipation of high-power devices has become one of the most challenging jobs in the field of heat transfer. For example, the heat flux of high-power light emitting diode (LED) already reaches 500 W/cm2. Heat transfer with liquid-vapor phase change is one of best solutions. Comparing with single-phase heat transfer, it has two main advantages: heat transfer coefficient can be much higher, since the evaporation disturbs the boundary layer; secondly, fluid temperature varies little after heat transfer, because evaporation usually happens at constant temperature. Considering these advantages, Heat transfer with liquid-vapor phase change has shown great potential in cooling LED, insulated gate bipolar transistor (IGBT) power module and so on.