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Beneficial Industrial Uses of Electricity: Materials Fabrication
Published in Clark W. Gellings, 2 Emissions with Electricity, 2020
A wide variety of shapes and sizes can be made by electroforming. Since the fabrication of a product requires only a single pattern, low production quantities can be made economically. In recent years, electroforming has taken on new importance in the fabrication of micro- and nano-scale metallic devices and in producing precision injection molds.
Fabrication Methods
Published in Anees Ahmad, Handbook of Optomechanical Engineering, 2018
Electroforming is the fabrication of free-standing components by the electrodeposition of a metal. Nickel and copper are the most common metals, however, many others can be utilized such as silver or gold. The requirements for an electroformed optical component are very stringent by most electroplating standards. By proper control of the chemistry and the process, in general, it is possible to deposit stress-free metal shapes with thicknesses of one or more millimeters which replicate a precision master surface. Numerous references are available regarding electroforming. A committee and dedicated symposiums meet to discuss the state of present applications. This is sponsored by the American Electroplaters and Surface Finishers Association located in Orlando, FL.
Fabrication Methods
Published in Anees Ahmad, Handbook of Optomechanical Engineering, 2017
Darell Engelhaupt, John Schaefer, Anees Ahmad
Electroforming is the fabrication of free-standing components by the electrodeposition of a metal. Nickel and copper are the most common metals; however, many others can be utilized such as silver or gold. The requirements for an electroformed optical component are very stringent by most electroplating standards. By proper control of the chemistry and the process, in general, it is possible to deposit stress-free metal shapes with thicknesses of one or more millimeters which replicate a precision master surface. Numerous references are available regarding electroforming.
Recent developments in hot embossing – a review
Published in Materials and Manufacturing Processes, 2021
Swarup S. Deshmukh, Arjyajyoti Goswami
The hot embossing (HE) process is mainly classified into two types: conventional hot embossing (CHE) and roller embossing. The detailed classification of conventional hot embossing is depicted in Fig. 4. In plate-to-plate hot embossing (P2P-HE), the workpiece is kept over the lower plate of the setup and heated beyond its Tg. For heating the polymer workpiece, a cartridge heater is fitted inside the lower plate. The micropatterns can be produced on the mold through UV-photolithography,[96] X-ray lithography,[97] electron beam lithography,[98] photolithography followed reactive ion etching,[99] micro-milling,[100–105] CNC milling,[106] focused ion beam milling,[107–109] micro-electroforming,[110] spark assisted chemical engraving,[111] micro-electric discharge machining,[112] electric discharge machining,[113,114] micro-electrochemical discharge machining,[115] wire electric discharge machining[116] and laser ablation.[117–122] Patterned anodic aluminum oxide template,[123] 3-D metallic printed micro-patterns on mold,[124] patterned polydimethylsiloxane (PDMS) stamp,[125] and micron size electric heating wire[126] have been directly used as a mold in a plate-to-plate hot embossing(P2P-HE). The mold is fixed to the upper plate. The setup is shown in Fig. 5 (a).
Investigation of the enhancement of microelectromechanical capacitive pressure sensor performance using the genetic algorithm optimization technique
Published in Engineering Optimization, 2021
Mohamed M. Y. B. Elshabasy, Mohamed A. Al-Moghazy, Hassan A. El Gamal
Because of the possible complexity, the possibility of a high aspect ratio and the tininess of the proposed sensor in the current investigation, the fabrication feasibility and other related challenges are surveyed. Among the various MEMS fabrication processes, the additive manufacturing (AM) techniques are an outstanding class. Over the past decade, there has been huge progress in the techniques of AM for both MEMS and, more recently, nanoelectromechanical systems (NEMS). Among these techniques are high-aspect-ratio microfabrication techniques such as lithography electroforming and moulding (Lithography Galvanoformung and Abformung or LIGA). This technique allows for the fabrication of miniaturized complex structures, such as gears, probes, springs and moulded nozzle plates for inkjet printers, with high aspect ratios (Prime Faraday Partnership 2002). Comparing the profile proposed in the current investigation with the complex micro- and nano-components listed above, the manufacturing process is relatively feasible. Yoon et al. (2014), Ingarao et al. (2018) and Li et al. (2018) have investigated the technical, economic and environmental challenges of these AM techniques compared to other manufacturing techniques.
Manufacturing methods for metallic bipolar plates for polymer electrolyte membrane fuel cell
Published in Materials and Manufacturing Processes, 2019
Oluwaseun Ayotunde Alo, Iyiola Olatunji Otunniyi, HCvZ Pienaar
Some studies have focused on the fabrication of microchannels using µ-EDM. Hung et al.[4] studied the fabrication of metallic BPs using µ-EDM milling. The authors achieved machining of channels with a depth, rib width, height, and AR of 500 µm, 500 µm, 600 µm, and 1.2, respectively, on a 50 mm × 50 mm × 1 mm SS 316L plate with a reaction area of 20 mm × 20 mm. Also, the power density of the SS plates reached 723.5 mW cm−2, and the volumetric power density was estimated to be higher than 315 mW cm−3, indicating higher performance compared to metallic BPs formed by electroforming or electrochemical machining techniques. However, a drawback of the µ-EDM milling is that it is a time-consuming and labor-intensive point-processing technique, and if repeated tests for various flow structures or mass production is desired, a relatively rapid process will be required.[4] Hung et al.[91] studied the fabrication of high AR micro-flow channels on SS 316L plate using die sinking µ-EDM, which is an area-processing technique. The results showed that processing time was significantly reduced due to a high discharging current that results in MRR as high as 7.2 mm3 min−1. However, the high MRR increases the surface roughness of the flow channels. Also, peak power densities of 674 mW cm−2 and 647 mW cm−2 for flow channels with a surface roughness of 0.715 µm Ra and 0.994 µm Ra, respectively, were achieved. This indicated a decrease in FC performance with increased BP surface roughness.