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LIGA and Micromolding
Published in Mohamed Gad-el-Hak, MEMS, 2005
Plating-through mask technology is successfully used in volume production of beam leads and bumps on IC wafers, fabrication of thin film magnetic heads, fabrication of PC boards, X-ray lithography mask gratings, and diffraction gratings. Electrodeposition in general has been used extensively in the electronics industry in many stages of the manufacturing process, from the device stage, chip carriers, and PC boards to corrosion protection and electromagnetic shielding of the electronic enclosures (see Tables 4.11 and 4.12). Processes include electrodeposition and electroless deposition of copper, nickel, tin, tin-lead alloys, and precious metals such as gold, gold alloys, palladium, and palladium alloys as well as NiFe, CoP, NiCoP, and other magnetic alloys [Romankiw and Palumbo, 1987].
Fabrication Methods
Published in Anees Ahmad, Handbook of Optomechanical Engineering, 2018
Electroforming is the fabrication of free-standing components by the electrodeposition of a metal. Nickel and copper are the most common metals, however, many others can be utilized such as silver or gold. The requirements for an electroformed optical component are very stringent by most electroplating standards. By proper control of the chemistry and the process, in general, it is possible to deposit stress-free metal shapes with thicknesses of one or more millimeters which replicate a precision master surface. Numerous references are available regarding electroforming. A committee and dedicated symposiums meet to discuss the state of present applications. This is sponsored by the American Electroplaters and Surface Finishers Association located in Orlando, FL.
Synthesis of Perovskite Oxides
Published in Gibin George, Sivasankara Rao Ede, Zhiping Luo, Fundamentals of Perovskite Oxides, 2020
Gibin George, Sivasankara Rao Ede, Zhiping Luo
Electrodeposition, also known as electroplating, is mainly used for depositing metals to a conducting surface from an ionic salt solution of the intended metal. Electrodeposition is a generally adopted technique for the fabrication of thin films on the metallic surfaces to induce corrosion protection, abrasion resistance, esthetics, and to reduce contact resistance. Electroplating can be extended for the deposition of multiple metallic elements as well. In the electroplating setup, the working electrode, electrolyte, power source or a potentiostat, and the counter electrode forms a closed circuit. A schematic of the electrodeposition process is shown in Figure 2.26. Sometimes, a reference electrode is also used as a reference potential for the potentiostat; however, the current flows only between the working and counter electrodes. The working electrode is the conducting material that is being plated, and the counter electrode is an inert material such as platinum or graphite. The flow of electrons take place through the ionic electrolyte by the movement of metallic cations in the electrolyte. In other words, as the working electrode is connected to a negative potential, the positively charged metallic ions in the electrolyte move towards the working electrode or cathode to adhere on the surface evenly to form a thin film on the surface. The process continues until all the cations are deposited on the surface of the cathode, and the rate of deposition in majorly affected by the applied current and cell potential.
Application of UV-synthesized anion exchange membranes to improve nickel removal through galvanic deposition process
Published in Journal of Dispersion Science and Technology, 2023
Masoud Delsouz Chahardeh, Ali Bozorg
Electrodeposition, also called electroplating, is a method of placing heavy metals on cathode electrode. This implies that the more the cathode surface area, the more the heavy metals would be removed from the solution and be deposited on the electrode. Furthermore, besides the type of the electrodes, the applied electrical potential could also significantly affect the overall performance of the electrolytic cells.[14,15] As an economic and efficient method, electrolytic cells have been widely studied and used to remove heavy metals from watery wastes. However, galvanic cells have shown to be even more cost effective than electrolytic cells.[16] Min et al.[17] developed an electrogenerative batch cell to remove and recover cobalt from artificial wastewater. In this study, it has been claimed that almost 100% of initial cobalt was deposited on the cathode electrode without applying any external potential and electrical current.
Study on dry sliding wear behaviour of nanocomposite coatings – an extended Taguchi’s method
Published in Tribology - Materials, Surfaces & Interfaces, 2021
C. R. Raghavendra, S. Basavarajappa, Irappa Sogalad
The coating by electrodeposition depends on various factors viz., temperature, current density, pH, stirring rate and % particle concentration [21]. Eslami et al. [22] incorporated Si3N4 micro particles in the Cu matrix by electrodeposition to study the effect of particle concentration and stirring rate on the deposition rate and wear resistance. The hardness and wear resistance of composite coating increased due to change of the preferred growth orientation of copper grains from (2 0 0) to (2 2 0) crystal face which is also evident from fewer plowing grooves. Ozkan et al. [23] carried out studies on the influence of particle concentration, current density and stirring rate on Ni–SiC nanocomposite coating. The optimum values of bath solution for better wear resistance at 20 g/L, 5 A/dm2 and 180 rpm are noticed and the dependencies of tribological properties of Ni–SiC coating on the weight percentage of nano SiC particles are concluded. Similar experiments were conducted by Mokabber et al. [24] in order to find the effect of temperature, current density and particle concentration on Zn–nano–TiO2 to obtain an optimum bath concentration. They noticed the influence of these parameters is significant on the wear resistance and maximum at 3 A/dm2, 2.5 g/L, 40°C in consideration with bath concentration, the pH value of electrolyte solution will also play a major parameter in deciding the quality of composite coating [25]. From literature it is evident that parameter optimization of electrodeposition is the key to achieve desired quality of micro/nanocomposite coating.
Electrodeposition of metallic molybdenum and its alloys – a review
Published in Canadian Metallurgical Quarterly, 2019
Siti Nur Hasan, Min Xu, Edouard Asselin
Electrodeposition refers to a film growth process that consists of the formation of a metallic coating onto a base material, called the substrate, through the electrochemical reduction of metal ions from an electrolyte. It is a relatively simple, low-cost and low-temperature technique combining good scalability to large and complex surface areas as well as sound manufacturability [16], which is applicable for most conducting or semi-conducting materials. While electrodeposition has proven to be an effective method in obtaining dense coatings with good uniformity and excellent adherence for a variety of metals, it has been difficult to electrodeposit molybdenum. The electrodeposition parameters, namely: type of electrolyte, current density, pH, temperature and bath composition (including concentration of reacting species), play a significant role in controlling the quality of deposited coatings [17]. These parameters vary for different Mo electrodeposition processes. The objective of this review is to gather and critically assess the information regarding the influence of operating conditions on deposited Mo properties to gain a better understanding of the process. It is hoped that this review will help with the development of superior Mo coatings for various potential industrial applications.