China
Africa
Explore chapters and articles related to this topic
Silicon Carbide Power Electronics Packaging
Published in John D. Cressler, H. Alan Mantooth, Extreme Environment Electronics, 2017
Jared Hornberger, Brice McPherson, Brandon Passmore
Discrete metal and ceramic packages are available from several manufacturers; however their larger counterparts that house several devices are not. Figure 69.16 is an image of a 26 pin power package. These packages have a base plate material comprised of GlidCop® or a metal matrix composite such as CoMo and either a glass or ceramic seal for the pin. The pin material is a 52 alloy copper core at 0.06 in. diameter and is capable of a continuous current rating of 35 A. A power substrate is required for electrical routing and isolation. This style of package may also be customized and manufactured with different base materials such as copper moly or copper tungsten to reduce CTE mismatches. An advantage with this type of package is flexibility—with variations in the power substrate, a variety of topologies (half-bridge, full-bridge, three phase, etc.) may be housed in the same footprint.
Design and Mounting of Metallic Mirrors
Published in Paul Yoder, Daniel Vukobratovich, Opto-Mechanical Systems Design, 2017
A form of copper called Glidcop AL-15, UNS C15715 having 0.3 wt% A12O3 has been used successfully for cooled beam folding and focusing mirrors in synchrotron beamlines (Howells and Paquin, 1997). The material can be ELN plated, ruled to make gratings, and brazed if special precautions are followed. Its characteristics are given in Tables 3.14 through 3.16 of Volume 1.
X-ray Shutters
Published in Paolo Russo, Handbook of X-ray Imaging, 2017
At APS, Undulator-A with a length of 2.5 m for 100 mA produced a total power of 5.2 kW; at a distance of 18.13 m, the photon shutter receives a heat flux of 500 W/mm2 at normal incidence. To withstand this power and power density from the source, the temperature distribution has been shown using the analytical solution with Gaussian heat flux. The material used is GlidCop. The thermal conductivity is 3.65 W/cm. The photon shutter is set at an angle of 1.5° to the beam path. More detailed information for design and thermal analysis can be found in the references (Shu et al. 1992; Job and Micklich 2005; Nian et al. 1992b, 1994; Chang et al. 1995). Canted undulators at the APS synchrotron facility will produce the two beams in order to have two beamlines available for different applications. The details of design and analysis of photon shutters are explained in Jaski et al. (2002). The front-end has two fixed masks and two photon shutters (PS1 and PS2). Under closed-gap conditions, with a beam current of 200 mA, the total power will be 20.4 kW, with a peak power density of 281 kW/mrad2 at the normal incidence. In order to overcome such high power, a dog-bone shaped cross-section design has been developed for the photon shutter; the design drawing can be seen in Figure 9.2. Here, we highlight some of the designed parameters. Due to the high heat load on the photon shutters, large temperature gradients and thermal stresses are evident. The shutters are fabricated by brazing the top and bottom halves together. The top half is made of oxygen-free high thermal conductivity (OFHC) copper with a thick GlidCop face-plate brazed on it, with the bottom half made of only OFHC copper. The properties of GlidCop are shown in Table 9.3. The shutters have water-cooling channels to efficiently dissipate rejected heat into the cooling water and, thus, minimize the thermally induced stress in them. The temperature and stress results of photon shutters implemented for canted undulators are shown in Table 9.4.
Thermohydraulic Design Analysis of the Target Assembly in the Material Plasma Exposure Experiment Facility
Published in Fusion Science and Technology, 2023
Adrian S. Sabau, Aftab Hussain, Federico Gallo, Adam M. Aaron
Based on radiological safety and remote-handling considerations and developed for the MPEX facility, pTAD has the following main features,5 which are shown in Fig. 1a: (1) The target is pressed onto a tungsten disk through a retainer mechanism comprising a target puck, tungsten shell (washer), and rings and (2) the tungsten target disk, puck, and tungsten shell are attached to water-cooled copper blocks, which are cooled by two spiral channels. In this study, the target assembly has been simplified based on further analysis of remote-handling considerations and additional considerations for specimen mounting, removal, and inspection. TAD has fewer components and fewer interfaces than pTAD, aiding MPEX operation. The major differences between MPEX TAD1 and the one used in this study (TAD) are the geometry of the cooling passages and the overall clamp design. pTAD uses two spiral channels while TAD involves a confined jet impingement geometry, similar to that shown in Fig. 1b (Ref. 7), which was successfully used to attain appropriate testing temperatures for clamped specimens during HHFT at 12 MW/m2 incident infrared heat fluxes (6 MW/m2 absorbed heat flux in tungsten). Glidcop Al-15, which is a copper-based material with 0.15 wt% Al2O3 particles, was selected as the material for the actively cooling component in TAD due to its high thermal conductivity and high strength at elevated temperatures.10
Plasma Wall Interaction of New Type of Divertor Heat Removal Component in LHD Fabricated by Advanced Multi-Step Brazing (AMSB)
Published in Fusion Science and Technology, 2023
Masayuki Tokitani, Yukinori Hamaji, Yutaka Hiraoka, Yuki Hayashi, Suguru Masuzaki, Hitoshi Tamura, Hiroyuki Noto, Teruya Tanaka, Tatsuya Tsuneyoshi, Yoshiyuki Tsuji, Gen Motojima, Hiromi Hayashi, Takanori Murase, Takeo Muroga, Akio Sagara, Tomohiro Morisaki
In a recent design of the DEMO divertor heat removal component, a copper alloy heat sink, or cooling pipe, was jointed with the backside of a tungsten (W) armor.1,2 Two candidate copper alloys, including a precipitation-hardened copper alloy (PH-Cu), e.g., CuCrZr, and an oxide-dispersion-strengthened copper (ODS-Cu), e.g., GlidCop® were considered. It is known that CuCrZr has been selected as a divertor cooling pipe for ITER (Ref. 3), and it is also the most promising copper alloy for the divertor cooling pipe and heat sink in many of the DEMO reactor designs.4,5 This is because CuCrZr has better fracture toughness and weldability than those of the GlidCop.6–9