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Contact Materials
Published in Milenko Braunovic, Valery V. Konchits, Nikolai K. Myshkin, Electrical Contacts, 2017
Milenko Braunovic, Valery V. Konchits, Nikolai K. Myshkin
Tin coatings (pure and alloyed) are distinguished in terms of the coating process, which consists of hot dip tinning or electroplating with or without reflow treatment.164 Tin coating performance will depend on a combination of the processing parameters used for tin plating, along with the environment to which the tin plated system is subjected to during the life of a connector system. A common plating process in Europe is hot dip tinning involving a hot air level system. Electroplating processes with or without reflow are mostly used in Japan. Depending on the design demands, both the hot dipping and the electroplating processes can provide the required thicknesses.
Basic Information
Published in John Hechtman, Ken Benshish, Audio Wiring Guide, 2012
Tinning wire is the process of coating it with a layer of molten solder, which also flows in between the copper strands of the conductors. It makes the wires easier to solder and also makes for a better connection. The process name comes from the fact that the basic alloy of solder is a tin/lead combination. This alloy is improved by the addition of a small amount of silver.
Interconnection technology
Published in Stephen Sangwine, Electronic Components and Technology, 2018
Four requirements must be met if a good soldered joint is to be made, and an understanding of these is essential in order to develop skill at hand soldering. First, the surfaces to be joined must be solderable. Not all metals are readily soldered without special techniques. Aluminium, for example, is an extremely reactive metal that rapidly oxidizes on exposure to air to form a passivating oxide layer that prevents solder from alloying with the underlying metal. It is possible to demonstrate the reactive nature of aluminium by removing the oxide layer with a little mercury rubbed onto the aluminium surface. The freshly exposed surface reacts rapidly with moisture in the air, and the metal becomes hot. Gold is very easily soldered because the metal does not oxidize. Copper and brass oxidize readily, but the oxide layer can be removed easily, so that these metals are solderable. The second requirement for a good soldered joint is cleanliness: the surfaces to be joined must be free of grease, dust, corrosion products, and excessively thick layers of oxide. In most electronics applications, the surfaces to be soldered will have been plated with gold or a solder alloy during manufacture in order to provide a readily solderable surface. Coating a metal with solder is known as tinning, and protects the metal from oxidation. Cleaning is not usually needed, therefore, unless a component or PCB has been stored for a long time or becomes contaminated with grease or dirt. The third requirement is that any layer of oxide on the surfaces must be removed during soldering and prevented from regrowing until the molten solder has alloyed with or “wetted” the surface. This is achieved by a flux that chemically removes the oxide layer and reduces surface tension, allowing molten solder to flow easily over the surfaces to be joined.
Stanislas Sorel and the origins of cold galvanising
Published in Transactions of the IMF, 2021
Even though the French chemist Paul Jacques Malouin had described the method of zinc-coating iron by hot dip galvanising as early as 1742,16 no useful application had been found almost a century later.17 During the 1830s iron gradually rose to dominance as the favoured construction material for the structural elements of buildings. Corrugated iron, invented in 1829,18 as well as flat iron sheeting saw increasing use as roofing material in the form of zinc sheeting or tinned iron; iron pipes for stoves and chimneys as well as water and gas became common. In most cases, corrosion protection was achieved through tinning.