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The Sputtered Thin Films as the Sensing Materials for the MEMS Gas Sensors
Published in Sam Zhang, Materials for Devices, 2023
Hairong Wang, Xin Tian, Yankun Tang
Sputtering is a process in a vacuum environment to deposit thin film on the surface of the substrate by bombarding the target material surface with the charged ions. Sputtering techniques are divided into magnetron sputtering, radio frequency (RF) sputtering, direct current (DC) sputtering, reactive sputtering, and other types. According to the type and the requirement of the deposited material, appropriate sputtering techniques can be selected. Moreover, one can get a new sputtering method by combining these techniques, e.g., the RF reactive sputtering is the combination of the RF sputtering and the reactive sputtering.
Physical Vapor Deposition Coating Process in Biomedical Applications
Published in Sarbjeet Kaushal, Ishbir Singh, Satnam Singh, Ankit Gupta, Sustainable Advanced Manufacturing and Materials Processing, 2023
Sivaprakasam Palani, Elias G. Michael, Melaku Desta, Samson Mekbib Atnaw, Ravi Banoth, Suresh Kolanji
The sputtering technique is often used by manipulating metal and oxide films for depositing crystalline structure and roughness of surfaces. The sputtering mechanism is based on the collision of the ions emitted from the discharge into the cathode molecules, leading to a higher kinetic energy release of the molecules from the cathode. Direct current and radio frequency (RF) sputtering are the two most common types of sputtering procedures. The first depends on DC power, which is usually used for target materials that are electrically conductive as a low-cost alternative that is easy to manage. RF sputtering uses RF power for most dielectric materials. A schematic representation of the PVD sputtering process is shown in Figure 5.4.
Fabrication and Characterization Methods
Published in Sheng-Kai Wang, 2/Ge System, 2022
One important advantage of sputtering as a deposition technique is that the deposited films have the same composition as the source material. The equality of the film and target stoichiometry might be surprising since the sputter yield depends on the atomic weight of the atoms in the target. One might therefore expect one component of an alloy or mixture to sputter faster than the other components, leading to an enrichment of that component in the deposit. Sputter deposition also has an advantage over molecular beam epitaxial (MBE) due to its speed. The higher rate of deposition results in lower impurity incorporation because fewer impurities are able to reach the surface of the substrate in the same amount of time. Sputtering methods are consequently able to use process gases with far higher impurity concentrations than the vacuum pressure that MBE methods can tolerate. During sputter deposition, the substrate may be bombarded by energetic ions and neutral atoms. Ions can be deflected with a substrate bias and neutral bombardment can be minimized by off-axis sputtering, but only at a cost in deposition rate. Plastic substrates cannot tolerate the bombardment and are usually coated via evaporation.
Recent advances and challenges associated with thin film coatings of cutting tools: a critical review
Published in Transactions of the IMF, 2023
A. Aditharajan, N. Radhika, B. Saleh
The sputtering process is categorised into DC (direct current) and RF (radio frequency) magnetron sputtering based on the energy source utilised for sputtering. The summary of the process parameters employed by various authors to fabricate thin films using the sputtering - PVD process is tabulated in Table 2. The addition of two or more elements by inter-diffusion into a base nitride is done by using simultaneous sputtering of elements, as shown in Figure 4c.43 The addition of Al to standard TiN coating increased its wear resistance, and by further addition of Si, the hot hardness and oxidation resistance were enhanced. An improvement in adhesion was achieved by combining magnetron sputtering of Si over an arc evaporated Ti-Al under N2 atmosphere. A hybrid coating method comprising arc ion plating (AIP) Ti and the addition of Al and Si by RF sputtering enabled control of the orientation of the TiAlSiN crystal structure.44 A comparison of DC magnetron sputtering, and cathodic arc vapour deposition revealed that arc vapour deposition contributed to heterogeneous coating while sputtering resulted in homogeneous coating.38 The large adatom mobility of arc evaporation increased the adhesion of coating and resulted in a denser structure compared to RF magnetron sputtering.47
Nanomaterials in 2-dimensions for flexible solar cell applications – a review
Published in Cogent Engineering, 2022
Benjamin Agyei-Tuffour, Kwadwo Mensah-Darkwa, Daniel Nframah Ampong, Elizabeth Adzo Addae, Gerald Selasie Gbadam, Clarisa Naa Shormeh Darko, Afia Owusua Akyaw, John Adjah, Joseph Asare, Guixiang Li, Neill J. Goosen
The sputtering process is based on the bombardment of target materials by ions generated by plasmas generated in DC and RF gas discharges (Figure 4b). When high-energy ions collide with the target material, the ions are ejected from the target material by the moving momentum of the Ar ions in the plasma, causing erosion of the target surface. The higher the RF or DC power applied to the target, the higher the energy of the particles emitted from the target. It must be noted that the energy of the ions ejected from the target depends on the momentum imparted by the ions in the plasma. Thus, the higher the density, the higher the sputtering rate from the target according to Bräuer et al., (2010). This high energy of ejected ions can be problematic due to the creation of defects on the substrate. Some of the recently studied 2D materials includes, graphene (semimetal), MoS2, WS2, MoSe2, (semiconductor) so called transition metal dichalcogenides (TMDCs), elemental 2D materials such as phosphorene, silicene, germanene, borophene (semiconductor and metal), Mxene 2D materials (most of them metallic), NbS2 (superconductor).
Structural colouration on textile fabrics with thin-film coating via magnetron sputtering: A review
Published in Surface Engineering, 2022
Mei-Lin Huang, Ying-Zhu Wu, Ning-Bo Yi, Sheng-Guo Lu
Physical vapour deposition (PVD) is a plasma-based method for depositing a thin coating on a substrate while maintaining high vacuum. In magnetron sputtering, which is a PVD technique, a magnetic field and plasma are both used. Because the substrate can be coated at room temperature, magnetron sputtering can be used to modify textile surfaces or coat thin films on textiles, utilising the attributes of the film to provide textiles with functional or decorative properties. The surfaces of textiles composed of different materials, such as polyester (polyethylene terephthalate (PET)) and polypropylene (PP), can be coated with single-layer films or multilayer composites of copper (Cu) [8–10], silver (Ag) [11–14], aluminium (Al) [15], titanium (Ti) [16], and other metals, alloys, compounds, or ceramics [17,18], as well as polymers, such as polytetrafluoroethylene (PTFE) [19–22] and polyimide (PI), using different targets, working gases, and appropriate sputtering processes. Single-layer or multilayer composite films provide textiles with one or more single or mixed functions, such as electrical conductivity, electromagnetic shielding, and antistatic, antibacterial, heat insulating, ultraviolet (UV) protective, and waterproof properties as well as hydrophobicity. This increases the grade, adds value to the product, and offers a workable method for creating and manufacturing intelligent textiles, wearable devices, and medical and healthcare materials.