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Interconnection technology
Published in Stephen Sangwine, Electronic Components and Technology, 2018
The most common lead-free solder for use in electronics is an alloy of tin (Sn), silver (Ag), and copper (Cu) in proportions of about 95 to 96% tin, 3 to 4% silver, and 0.5 to 1% copper. Alloys of this composition have a melting point of around 215 to 218°C, which is somewhat higher than the melting point of a 60:40 tin:lead solder. Figure 2.3 shows part of the phase diagram for the tin–silver–copper alloys (the full phase diagram takes the form of an equilateral triangle, but since a practical alloy for electronic soldering has 95 to 96% tin, only one corner of the full diagram is shown). Temperature is shown by contour lines, since to plot them would require a third dimension, out of the page. The higher melting point of lead-free solders means that more care has to be taken to control soldering processes, since the higher temperatures could more easily cause thermal damage to electronic components.
Metal Joining Techniques Using Brazing
Published in Yoseph Bar-Cohen, Advances in Manufacturing and Processing of Materials and Structures, 2018
Yoseph Bar-Cohen, Dusan P. Sekulic, Rui Pan, Sudarsanam Suresh Babu, Anming Hu, Denzel Bridges, Xiaoqi Bao, Mircea Badescu, Hyeong Jae Lee, Stewart Sherrit
Soldering is a process in which two or more metal/nonmetal parts are joined by melting and flowing a filler metal (solder) into the joint. As the convention, it is assumed that all such processes if they taking place at temperatures below 450°C, they should be called soldering. In any case, the filler metal has a lower melting point than the adjoined materials. Soldering is different from welding since it does not involve melting the base metals.
Weld Design and Joining
Published in Zainul Huda, Manufacturing, 2018
In brazing and soldering, a filler is melted to form the joint (see Figure 13.2). Brazing is a joining process in which a filler metal is melted and distributed by capillary action between the faying surfaces of the metal parts. In brazing, the filler metal has a melting temperature above 450°C but below the melting temperature of the base metal (Zaharinie et al., 2015). Soldering is a joining process in which a filler metal with melting point below 450°C is melted and distributed between the faying surfaces of the metal parts.
On the estimation of the size of a subgroup in industrial production: The test gate method
Published in Quality Engineering, 2019
Lennart Kann, Daniel Herrmann, Rainer Göb
Soldering is a standard process to assemble parts onto printed circuit boards (PCBs) in electronic mass production. To join the parts and the PCB, a solder is placed into the joint. During the process, the solder material has to be melted to create a permanent connection between the PCB and the part. Under some circumstances, a solder ball may form during the process on the PCB. One such solder ball is depicted in Figure 2. With optimally adjusted soldering process parameters, almost no solder balls occur. Generally, solder balls cannot be avoided completely.