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Epilogue: Where Are We Headed with the Cyber Nightmare?
Published in Rocky Dr. Termanini, The Nano Age of Digital Immunity Infrastructure Fundamentals and Applications, 2018
Miniaturization of microprocessors is currently in process at nanometer scales. For example, computer graphics and image processing have been used in nanomanipulators that provide researchers an interactive system interface to scanning probe microscopes. Conventional methods to miniaturize the size of transistors in silicon microprocessor chips will soon reach its limit, and the modification of today’s top-down technology to produce (from large to small size) nanoscale structures is difficult and expensive. Feynman and Drexler proposed a new style of technology, which assembles individual atoms or molecules into a refined product. Drexler coined the term molecular technology or bottom-up technology (from small to large). This bottom-up technology will be the answer for the computer industry and, in particular, for cybersecurity.
Introduction
Published in George K. Knopf, Kenji Uchino, Light Driven Micromachines, 2018
Machines at the micro scale often have advantages in speed, accuracy, and “gentleness” (Trimmer 1989; Sitti 2007). Common physical limitations imposed on much larger macro-machine design associated with phenomena such as the temperature coefficient of expansion, mechanical deflection, and vibration become less problematic when the mechanisms are reduced in size. In addition to improved performance these micromachines are lower cost because the amount of material needed to create the device and fabrication processes are less time consuming. Smaller technologies also enable designers to exploit more exotic materials to develop new types of sensors and actuators, and improve system functional performance. Miniaturization has the added advantage of reducing the physical size or spatial footprint on a much more integrated technology or system. Furthermore, the small forces and masses associated with these microsystems make the technology more “gentle” and less harsh on the operator or environment. From a design perspective the reduction in size often makes functional and economic sense, but simply reducing the physical size of current macro-scaled mechanisms and machines will not reach the true potential of microtechnology or, in some cases, may not even be physically realizable.
Packaging and Assembly of Microelectronic Devices and Systems
Published in Anwar Sohail, Raja M Yasin Anwar Akhtar, Raja Qazi Salahuddin, Ilyas Mohammad, Nanotechnology for Telecommunications, 2017
The electronics package miniaturization has spawned a revolution in miniaturized sensors and micromechanical devices, which find a wide array of applications in consumer electronics, telecommunication, complex medical systems, global positioning and tracking, guidance and navigation, etc. Micromechanical sensors for pressure and acceleration have used semiconductor manufacturing technology for several decades, but recent innovations allow further miniaturization, greater flexibility, and compatibility with microelectronics. Biosensors and chemical sensors that can sense gases and chemicals are being perfected using IC manufacturing techniques and will be used in medical, food processing, and chemical processing applications. Even though miniaturized microelectronics devices will find usage in a variety of applications, the scale of the physical products that make use of these devices is still considerably larger and requires further packaging to ease the assembly of these devices into the product (Figure 14.2).
Effects of electrode materials on performance measures of electrical discharge micro-machining
Published in Materials and Manufacturing Processes, 2018
J. Cyril Pilligrin, P. Asokan, J. Jerald, G. Kanagaraj
Today, industries are following various strategies to survive in global competition. Miniaturization is one of a kind, where the commercial products are reduced in size without losing its functions. Hence complexity of these products is also increased. To make these complex products commercially feasible, it has to be manufactured with high quality, high strength-to-weight ratio, and at minimum cost. Particularly in engineering and medical applications, such as micro-channels, fuel injection nozzles, micro-pump, micro-engines, hard disk reading cap, connectors, switches, pacemakers, sensors, optical devices, and surgery tools.[123] Manufacturing of these devices with traditional machining, such as micro-drilling or micro-milling, is difficult hence nontraditional machining process, such as electrical discharge micro-machining (EDMM), are preferred among other processes.[4,5] EDMM is a tool-based micro-machining process which is capable of generating micro-features on hard-to-cut materials like stainless steel.
Automation of tool path generation in multi-process micromachine tool for micromachining of prismatic and rotational parts
Published in International Journal of Computer Integrated Manufacturing, 2018
Miniaturisation plays an important role due to technology developments in the field of semiconductor, automobile, aerospace, bio-medical industries, so on. Micromachining ensures creation of micro parts without compromising the functionality (Asad et al. 2007). Appropriate decision-making is a challenging task in micromachining than traditional manufacturing. Computer-aided manufacturing (CAM) is an efficient approach to mechanise the series of activities to be performed for micro-manufacturing. It deals with the use of computer system to plan, manage and control of operations of a machine tool within the plant production resources (Groover and Zimmers 2001). The activities of a typical CAM system include computer-aided process planning (CAPP), computer numerical control (CNC) code generation, production scheduling, condition monitoring, so on, according to the sophistication of a manufacturing system.
Cutting fluid behavior under consideration of chip formation during micro single-lip deep hole drilling of Inconel 718
Published in International Journal of Modelling and Simulation, 2023
Ekrem Oezkaya, Andreas Baumann, Sebastian Michel, Dirk Schnabel, Peter Eberhard, Dirk Biermann
Single-lip deep hole drilling (SLD) is becoming more and more important because of high length-to-diameter ratios and high achievable bore hole quality for bore holes even with smallest diameters. Because of the high bore hole quality the process is even used for short holes. The trend towards miniaturization is often associated with a high degree of complexity and places high demands on process reliability. This applies especially for micro SLD with very small diameters and large length-to-diameter (l/d) ratios. Micro-bore holes are predominantly found on components that are required for medical technology and in the textile, automotive, and plastics industries. In these areas of application hard-to-cut high-performance materials such as Inconel 718 are often used, which pose particular challenges to the tools [1]. Decisive disadvantages of SLD are the low adjustable feed rates, which are mainly determined by the wear resistance of the cutting edge and the stability of the tool, as well as the dependence on a process-reliable generation of suitable chips for the removal from the bore hole [2]. With micro SLD, the chip is formed in the smallest of spaces and neither chips that are too long nor chips with an unfavorable shape are desirable [3]. In the case of long chips, the removal can lead to chip congestion and with unfavorable, folded chip geometries there is a risk of chip jamming. A reliable chip transport should be ensured by a sufficient cutting fluid flow [4]. However, experimental investigations of chip formation and chip transport with additional consideration of the cutting fluid during deep hole drilling and in particular during micro SLD are difficult due to the restricted accessibility of the contact zone of cutting edge and workpiece.