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Experiments using low viscosity resins for in situ sampling of sand and tailing and sample analysis by image processing
Published in Raj K. Singhal, Geotechnical Stability in Surface Mining, 2022
Christopher H. Roe, Eric G. Zahl
One material which shows promise is ConcresiveR AEX-2075, a low-viscosity, acrylic monomer designed for sealing and reconsolidating concrete substrates. Conversion of the ConcresiveR from the liquid to the solid state requires the use of a promoter-initiator system. The recommended materials are cobalt naphthenate and cumene hydroperoxide mixed together in a ratio of 100 parts ConcresiveR monomer, 4 parts cumene hydroperoxide, and 1 part cobalt naphthenate. The resulting mixture has a dynamic viscosity that varies from 30cP at 2° C to 10cP at 38° C. The gel time ranges from 385 minutes at 2° C to 35 minutes at 38° C. ASTM standard linear shrinkage tests indicate ranges between 0.4 mm and 0.55 mm per linear meter. Volumetric shrinkage tests have not been performed yet. These should be completed to ensure that vertical shrinkage, which was not measured in the linear shrinkage test, does not affect interparticle relationships. The cured adhesive is a hard, blue-green, semi transparent solid that can be easily cut by a diamond blade saw.
Three-Dimensional Finite Element Modelling of the Mechanical Behaviour of Human Vertebral Cancellous Bone
Published in J. Middleton, M. L. Jones, G. N. Pande, Computer Methods in Biomechanics & Biomedical Engineering – 2, 2020
H. Walter, F. Lbath, D. Mitton, E. Cendre, C. Rumelhart
The anatomical vertebral axes were marked on specimens. Cylinders were taken from the left central part of the vertebral body with a 14 mm core drill. 9mm cubes (Figure lb) were obtained with a low speed diamond blade saw (Isomet). Once the machining was done, samples were kept in a 50% saline-ethanol solution [7] at 4°C for 3-4 days before testing. Each specimen was placed two hours at room temperature prior to mechanical tests.
Detector Fabrication
Published in Alan Owens, Semiconductor Radiation Detectors, 2019
For epitaxial produced material, the end product is a wafer of semiconducting material between 2 inches and 8 inches in diameter, although for most compound semiconductors, wafer sizes are limited to 2 inches. Once processed and patterned with particular device structures, on-wafer testing of each chip is carried out and the wafer is separated into individual chips, commonly referred to as wafer dicing. Depending on the wafer material and its thickness, dicing is achieved by (i) scribing along selected crystallographic planes and breaking, (ii) cutting with a high precision diamond blade or (iii) laser cutting. For melt grown crystals, the ingot or boule is first sliced into wafers using a diamond tip or wire saw and the surfaces lapped and polished prior to patterning and dicing. All other operations beyond this point are identical.
Wear-resistant iron-based Mn–Cu–Sn matrix for sintered diamond tools
Published in Powder Metallurgy, 2018
Janusz Stefan Konstanty, Elzbieta Baczek, Andrzej Romanski, Dorota Tyrala
Nowadays, diamond blades and wires are commonly used for cutting natural stone, concrete and ceramics. The cutting section of the tool consists of synthetic diamond crystals embedded in a metallic matrix by various PM fabrication routes [1]. While cutting, the protruding diamonds pass over the machined material, wearing away its mineral constituents, which, in turn, abrade the matrix, to expose fresh crystals that take over the cutting action from mechanically degraded or dislodged diamonds.