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Fabless Intelligent Manufacturing
Published in Chinmay K. Maiti, Fabless Semiconductor Manufacturing, 2023
A business that is a dedicated semiconductor fabrication facility does not design its own ICs. The term “fab” refers to anysemiconductor fabrication plant, whether run as part of an IDM (like Intel) or as a foundry (like TSMC). An application-specific IC refers to a chip that is custom-designed for a specific application, rather than for a general-purpose application. This type of company that developed in the 1980s performed the physical design and manufacturing of these application-specific ICs for other semiconductor or systems companies. An IC that integrates all components of a computer or other electronic system into a single chip is known as a system-on-chip (SOC). On a single substrate, it may contain digital, analog, mixed-signal, and sometimes radio-frequency functions. A company that designs its chip but outsources the manufacturing to a third party, either a foundry or an IDM is called the fabless company. This is the prevailing business model today. Electronic design automation (EDA) companies make the software that is used to design all modern semiconductor devices. The three dominant EDA companies today are Synopsys, Cadence Design Systems, and Mentor Graphics.
System Exploration for Custom Low Power Data Storage and Transfer
Published in Keshab K. Parhi, Takao Nishitani, Digital Signal Processing for Multimedia Systems, 2018
Francky Catthoor, Sven Wuytack, Eddy De Greef, Florin Balasa, Peter Slock
Up to now, little design automation development has been done to help designers with this problem. Commercial EDA tools, such as SPW/HDS (Alta/Cadence Design), System Design Station (Mentor Graphics) and the COSSAP environment (CADIS/Synopsys), support system-level specification and simulation, but are not geared towards design exploration and optimization of memory or communication-oriented designs. Indeed, all of these tools start from a procedural interpretation of the loops where the memory organization is largely fixed. Moreover, the actual memory organization has to be indicated by means of user directives or by a partial netlist. In the CASE area, represented by, e.g., Statemate (I-Logix), Matrix-X (ISI) and Workbench (SES), these same issues are not addressed either. In the parallel compiler community, much research has been performed on loop transformations for parallelism improvement (see e.g., [21, 22, 23, 24]). In the scope of our multimedia target application domain, the effect on memory size and bandwidth has however been largely neglected or solved with a too simple model in terms of power or area consequences, even in recent work.
Overview
Published in Luciano Lavagno, Igor L. Markov, Grant Martin, Louis K. Scheffer, Electronic Design Automation for IC System Design, Verification, and Testing, 2017
Luciano Lavagno, Grant E. Martin, Louis K. Scheffer, Igor L. Markov
EDA tools span a very wide range, from logic-centric tools that implement and verify functionality to physically-aware tools that create blueprints for manufacturing and verify their feasibility. EDA methodologies combine multiple tools into EDA design flows, invoking the most appropriate software packages based on how the design progresses through optimizations. Modern EDA methodologies can reuse existing design blocks, develop new ones, and integrate entire systems. They not only automate the work of circuit engineers, but also process large amounts of heterogeneous design data, invoke more accurate analyses and more powerful optimizations than what human designers are capable of.
Graphene-based electrodes for ECG signal monitoring: Fabrication methodologies, challenges and future directions
Published in Cogent Engineering, 2023
Rimita Dey, Pravin Kumar Samanta, Ram Pramod Chokda, Bishnu Prasad De, Bhargav Appasani, Avireni Srinivasulu, Nsengiyumva Philibert
Due to its unique properties, graphene can be used in various fields of application such as solar cells (Patchkovskii et al., 2005), hydrogen storage (Brownson & Banks, 2012), supercapacitors (Eda & Chhowalla, 2010; Yoo et al., 2011), electronics (Raju et al., 2014), strain sensors (Bunch et al., 2007), electromechanical systems (Schwierz, 2010), field effect transistor (Papageorgiou et al., 2015) and high end-composite materials (Potts et al., 2011; Shen et al., 2012). Graphene is a zero-gap semimetal with a two-dimensional planar structure, making its use in many applications difficult. Hence, graphene is being processed and made into different forms, for example, quantum dots (Jia et al., 2011) and nano-ribbons (Xue et al., 2012) and are used in foams (Wu et al., 2012; Xu et al., 2010) and in hydrogels (Song et al., 2020) for energy and biological applications. These are also used in semiconductor devices and for designing supercapacitor electrodes. With high power densities and quick charge/discharge cycles, supercapacitors, also known as ultra-capacitors or electrochemical capacitors, store energy through quick and reversible charge accumulation at the electrode-electrolyte interface. Graphene-based supercapacitor electrodes take advantage of the unique characteristics of graphene to achieve excellent performance and efficiency.
HardOps: utilising the software development toolchain for hardware design
Published in International Journal of Computer Integrated Manufacturing, 2022
Julian Stirling, Kaspar Bumke, Joel Collins, Vimal Dhokia, Richard Bowman
The key benefit of using this automation is de-duplication of design information, having a single source of truth, and a guarantee that essential production files remain up to date. For example, an engineer will design parts using a CAD or electronics design automation (EDA) package, and save them in the native format of their CAD/EDA package. The native format retains essential parameterisation for future adjustment, but before the part can be produced the data needs to be exported either in an exchange format (e.g. STEP, STL), as technical drawings or schematics, or as computer numerical control (CNC) production files (e.g. G-code, Gerber). Saving these output files within the DVCS not only rapidly increases data storage, but also runs the risk of out of date production files being used.
Fabrication of Stress and Temperature Measurement Sensors and Possible Integration with Fabricated Biodegradable Drug Delivery Device
Published in IETE Journal of Research, 2021
Joyline D’sa, Divyesh Sachan, Manish Goswami
The fabrication of stress [20] and temperature measurement sensors for electrodermal activity measurement is done first followed by the macrofabrication of biodegradable drug delivery device. The flexible stress and temperature EDA sensors is designed, fabricated, and tested, minimizing its size, cost as well as increasing device flexibility to increase the wearing comfort, thus demonstrating sensor’s potential for human bio-signal monitoring applications, such as mobile electronics and wearable devices [21,22]. The design, fabrication and testing of RB-DDS with the future possible integration of stress mesaurement and its control using the fabricated RB-DDS is also done and presented.