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Session Initiation Protocol
Published in Giovanni Bartolomeo, Tatiana Kováčiková, Identification and Management of Distributed Data: NGN, Content-Centric Networks and the Web, 2016
Giovanni Bartolomeo, Tatiana Kováčiková
As early as 2001, vendors began to launch SIP-based services. Since that time, the enthusiasm for the protocol has been growing. Organizations such as Sun Microsystems’ Java Community Process are defining application programming interfaces (APIs) using the popular Java programming language so developers can build SIP components and applications for service providers and enterprises. Most importantly, increasing numbers of players are entering the SIP marketplace with promising new services, and SIP is on track to become one of the most significant protocols since the Hypertext Transfer Protocol (HTTP) and the Simple Mail Transfer Protocol (SMTP). SIP technology is still evolving, but the core specifications have been fully standardized, adopted, and widely implemented. Many commercial products and communication platforms on the market are SIP based, including those from Cisco™, Microsoft®, Avaya®, and Radvision®. SIP also brings the Internet approach to multimedia real-time communication; thus, SIP communication may be seen as just another Internet Protocol (IP) service, running on standard hardware and standard operating systems and middleware. Thanks to this approach, many high-performance and high-quality software products are available under some form of open-source or free software licenses. These products together with the appropriate software packages can be used to create a rich multimedia converged network (Segec and Kováčiková 2011).
Interconnection Technology
Published in Yufeng Jin, Zhiping Wang, Jing Chen, Introduction to Microsystem Packaging Technology, 2017
Yufeng Jin, Zhiping Wang, Jing Chen
Worldwide, many large electronics companies and research institutions are developing SIP technologies and relevant products. For example, Fujitsu developed a new SIP technique, CS module (chip-scale module), in 2002. Compared with old SIP techniques, the new technique greatly reduces packaging area. In this technique, chips are stacked on bare chips using protective film. Copper wiring interconnection other than wire bonding technique is used between chips. Most importantly, all assembly processes of CS module are conducted in the wafer level. The precision of bonding chips onto wafers is ±5 µm.[3]
Bandwidth enhancement and cross-polarization suppression of slot antenna
Published in Electromagnetics, 2021
Khan Masood Parvez, Sk. Moinul Haque
The proposed antenna layout is shown in Figure 6. The return loss characteristics of reference slot antenna and antenna loaded with vertical wires have shown in Figure 7. The improvement of −10 dB bandwidth has been shown in Table 1. The poor cross-pol characteristics of Figure 5 can be improved by this proposed antenna topology. The field components which contributed to increasing the cross-pol components are cancelled out by the oppositely directed field components due to the presence of circular vertical metallic wire loops. It is evident from Figure 8 that cross-pols are less in comparison with radiation characteristics of Figure 5. The antenna topology can be used for mass production through a system on package or multilayer printed circuit board (Tummala and Laskar 2004) where vertical space is free for wire loop integration. The vertical wire has an inner diameter (D3) = 9.00 mm, outer diameter (D4) = 11.00 mm, the distance (DCR) = 10.50 mm from the center of the slot, and distance (DVW) = 9.00 mm between the two vertical wires, respectively, and it penetrated the substrate as shown in Figure 6. In Figure 7, it is observed that the simulated values for loaded and reference antennas are 1.78 and 2.05 GHz, respectively.