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Experimental Techniques
Published in Marco Ferrero, Roberta Arcidiacono, Marco Mandurrino, Valentina Sola, Nicolò Cartiglia, An Introduction to Ultra-Fast Silicon Detectors, 2021
Marco Ferrero, Roberta Arcidiacono, Marco Mandurrino, Valentina Sola, Nicolò Cartiglia
The I(V) and C(V) measurement setups described in the previous sections are suited to test sensors with a small number of pads or strips. The test of multi-pad devices, with tens or hundreds of electrodes, need the use of a custom made multi-needle probe card, with needles to contact the pads connected via a switching matrix to the SMUs and the needle to contact the guard-ring connected directly to the HV-SMU. The probe card is a Printed Circuit Board (PCB) instrumented with needles to contact the electrodes of the devices under test. The switching matrix allows connecting a variable subset of the pads to a given SMU, grounding those not under test. Figure 4.7 shows a schematic representation of a setup with the electrical connections needed for I(V) measurements of a multi-pad device.
Miniaturization of Complex Ceramics
Published in Debasish Sarkar, Ceramic Processing, 2019
High density 50 ± 1 μm diameter hole arrays on 250 μm thick alumina on a 60 μm pitch without any defects was drilled using 20 ns pulse-duration CVL of power 3 W at a 10 kHz pulse frequency (Figure 9.17a). This micromachined ceramic substrate is predominately used in semiconductor test probe-cards. In a single operation, the micron-scale drilling, cutting, and milling of a 0.3 mm thick alumina sheet was performed using CVL, and 45° chamfers along the edge of the bar were created using controlled depth ablation, as shown in Figure 9.17b. The depth variation was adjusted through the total number of pulses used [67].
Probe card-Type multizone electrostatic chuck inspection system
Published in Automatika, 2023
Yoon Sung Koo, Jae Hwan Kim, Chan Su Han, Sang Jeen Hong
Generally, a probe card refers to a component used for equipment inspection that selects defective products by determining their electrical performance and identifying circuit failure by physically contacting the manufactured integrated circuit (IC) chip on a wafer. A probe card comprises of a thin wire probe attached to a specific standard circuit board. There are various types of probe cards, including horizontal, vertical, and micro electro-mechanical system [12, 13]. Multiple probe tips are required to inspect the manufactured chips on wafers. Different probe tips may be used depending on the test equipment. Digital control of multiple-channel multiplexers (MUXs) is required for efficient inspection [14]. The probe card developed in this study was designed on a printed circuit board (PCB) as it was confirmed to be suitable for measuring the resistance of ESC heating electrodes. Figure 2 shows a schematic of the probe card-type heating electrode resistance measurement system. The top-side ceramic puck was debonded from the base metal plate of an ESC to be tested during the repair procedure to examine the heating electrode terminal on the backside [15]. Multiple probe tips were placed under the PCB based on the terminal position of the heating electrode. All probe tips were rounded to prevent damaging the heating electrode terminal, and all probe tips needed to be in contact with the terminal. A spring-type probe tip with a movement range of 1 mm was selected for all terminals to be in constant contact, and uniform contact with the heating electrode terminal was ensured. Each probe tip had a length of 6 mm and radius of 1.5 mm. To minimize physical scratches on the heating electrode connector of the test ESC, a round shape was selected for the contact area of the probe tip. The probe tip was finished with gold and nickel to allow electrical signals to pass through.
Heat treatment effects on mechanical properties of Ni–Co alloy thin films
Published in Mechanics of Advanced Materials and Structures, 2019
S. J. Kim, H. W. Jung, M. W. Lee, Y. J. Kim, Y. H. Huh, J. H. Park
Probe card is a device which tests whether circuit on wafer works well or not and determines skipping unnecessary following process like assembling, and this would help improve the production yield rate. The probe card has lots of probes arranged in regular format on the circuit board, and the probe card performs the checking process by contacting these probes directly to pads of circuit or semiconductor with pressure or contact load.