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Application-Specific Integrated Circuits
Published in David R. Martinez, Robert A. Bond, Vai M. Michael, High Performance Embedded Computing Handbook, 2018
M. Michael Vai, William S. Song, Brian M. Tyrrell
The development of packages over the last three decades was aimed at two categories: those that contain one chip, namely single-chip modules (SCM), and those that can support more than one chip, called multichip modules (MCM). MCM can support up to and in excess of 100 chips. Packages are made of either plastic or ceramic. The package can be connected to the printed circuit board with pins or with pads/balls.
Multichip Module Technology
Published in Jerry C. Whitaker, Microelectronics, 2018
In short, most MCM system design issues are decided on by careful modeling of the system-wide cost and performance. Despite the higher cost of the MCM package itself, often cost savings achieved elsewhere in the system can be used to justify the use of an MCM.
Interconnection Technology
Published in Yufeng Jin, Zhiping Wang, Jing Chen, Introduction to Microsystem Packaging Technology, 2017
Yufeng Jin, Zhiping Wang, Jing Chen
The interconnection of chips is one of the most important components of the MCM technology. Wire bonding, tape automated bonding, and flip-chip bonding are the core of the MCM interconnection technology. Typical applications in MCM are as follows:
Electromagnetic Simulation and Realization of MCM GaAs MMICs Based Packaging for High Gain (40 dB) and High-Power (33dBm) Transmitter Applications
Published in IETE Journal of Research, 2022
Ravi Gugulothu, Sangam Bhalke, Lalkishore K, Ramakrishna Dasari
A multi-chip module (MCM) defines a narrowly integrated, functional specific circuit block, which consists of two or multiple bare integrated circuits (MMICs) planned on the same substrate/wafer. Based on the multi-chip module technique it is possible to realize small-sized systems with higher die packaging densities and smaller interconnections and transitions which result in good system parameters.