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Power Distribution Equipment, Instrumentation and Electronic Safety Devices
Published in S. Bobby Rauf, Electrical Engineering for Non-Electrical Engineers, 2021
However, once again, care should be exercised to protect the PLC, and associated I/O, Inputs and Outputs, from potential EMI emitted from power components in close proximity. The leftmost picture of a PLC shown in Figure 8.21 (a) depicts a SLC 500 PLC and associated I/O blocks. In Figure 8.21 (a), adjacent to the CPU, Central Processing Unit—the PLC power supply is shown mounted to the “back plane” of the PLC. A backplane, often, consists of a circuit board with rigid connectors that the I/O modules, CPU module and the power supply can be plugged into. A PLC, not unlike a PC (Personal Computer), operates off of low DC voltage, 5-10 V. This low DC voltage is generated by the PLC power supply. The power supply, in turn, is powered by low AC voltage. The PLC control transformer, shown in Figure 8.21 (a), transforms the 480 VAC—available at the 480 VAC bus stabs—into a lower AC voltage (≈14 VAC). This lower AC voltage is converted from AC to DC by the rectifier in the power supply.
Spatial light modulators
Published in Neil Collings, Fourier Optics in Image Processing, 2018
All the devices discussed in this chapter are electrically addressed using an active backplane. The backplane is the addressing structure of row and column electrodes, and ‘active’ refers to the presence of one or more transistors at each intersection of row and column. The reflective devices are based on integrated circuits in single crystal silicon. These are fabricated using either complementary metal oxide semiconductor (CMOS) or N-type metal oxide semiconductor (NMOS) processing. The CMOS processing is usually categorized by the minimum feature size, e.g., 0.18 μm $ \mu m $ . In general, the smaller the feature size, the smaller the pixel size of the EASLM, because the circuitry can be accommodated within a smaller area. The full wafer of silicon (up to 300 mm diameter) provides a large number of backplanes. Fuller details of the backplane technology are given in [10]. The transmissive devices are liquid crystal devices driven by either a CMOS backplane which has been thinned sufficiently to become transparent, or thin film transistors (TFTs). The thinned backplane is attached to a suitable transparent substrate, such as sapphire, in order to provide mechanical support, whereas the TFT device is built up by processing layers deposited onto a transparent substrate, such as glass. The latter process has been perfected for large size displays, such as computer monitors and televisions.
Electrical Power Distribution and Control Equipment, and Safety-Related Devices
Published in S. Bobby Rauf, Electrical Engineering Fundamentals, 2020
However, once again, care should be exercised to protect the PLC and associated I/O from potential EMI emitted from power components in close proximity. The left picture of a PLC shown in Figure 8.21 depicts a large ControlLogix PLC and associated I/O blocks. In Figure 8.21, adjacent to the CPU, Central Processing Unit – the PLC power supply is shown mounted to the “backplane” of the PLC. A backplane, often, consists of a circuit board with rigid connectors that the I/O modules, CPU module, and the power supply can be plugged into. A PLC, not unlike a PC (Personal Computer), operates off of low DC voltage, 5–10 V. This low DC voltage is generated by the PLC power supply. The power supply, in turn, is powered by AC voltage.
Safety Criteria and Dependability Management Practices: A Case Study with I&C Systems of Prototype Fast Breeder Reactor
Published in Nuclear Technology, 2018
Srikantam Sravanthi, R. Dheenadhayalan, K. Madhusoodanan, K. Devan
All systems that form part of the shutdown system are hardwired analog or digital electronic systems (without software) except for core temperature monitoring system (CTMS). This option is preferred to avoid complications related to quantifying software reliability. However, CTMS is computer based since arithmetic operations on around 423 thermocouple channels are to be performed.15 These signals are monitored and processed by triple redundant real-time computers (RTCs). RTCs are modular with CPU, analog input card (AIC), digital input card (DIC), analog output card (AOC), and relay output card (ROC) on Versa Module Europa (VME) bus backplane. Table III lists the diagnostic features incorporated in these cards aimed at reducing λDU. Each RTC generates scram signals upon detecting a failure. “Software hang” conditions will lead to generation of scram. Power supply failures will lead to generation of scram. Apart from this, a periodic test input (manually triggered) provision is given to exercise the watchdog timer and the electromagnetic (EM) relays used to generate scram.
Verification and Validation of RAPID Formulations and Algorithms Based on Dosimetry Measurements at the JSI TRIGA Mark-II Reactor
Published in Nuclear Science and Engineering, 2021
Valerio Mascolino, Alireza Haghighat, Luka Snoj
Table VIII indicates that RAPID calculations yield accurate eigenvalues and detailed fission density distributions in 9 s using one core while the Serpent code requires multiple days on tens of cores. In particular, RAPID achieves a speedup of several orders of magnitude for both the examined cases. The system used for all the calculations is a computer cluster with the following specifications: 56 cores (Intel Xeon 2400 Mhz), 256 Gbytes system memory (8 Gbytes/core), 3 Tbytes storage, and Gigabit Network backplane. It is important to note that the precalculations can be completed in 40 min using 3560 cores. Note that a fixed-source Monte Carlo calculation is highly scalable in a parallel environment; hence, this time can be reduced further by adding more cores.
Structure design of LFT passenger car seat structure based on topology optimisation
Published in International Journal of Crashworthiness, 2021
Junyuan Zhang, Zhongyu Li, Tao Sang, Mengxue Ji
Because the left and right seat backplanes have the same structure and working conditions, a single seat backplane is selected as the topology object. At the same time, considering that the LFT components mostly use injection-molded plate structures, they can be formed into more complex structures, and even can be integrated [15]. Therefore, the initial optimisation space of the bus LFT seat backplane topology optimisation is defined as the integration shown in Figure 11. The structure of the plate, its overall shape and size are the same as those of the original passenger car seat backplane.