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Failure Analysis
Published in Robert Doering, Yoshio Nishi, Handbook of Semiconductor Manufacturing Technology, 2017
For high pin count devices (greater than 300 pins), there remain cases such as continuity and simple parametric failures, where the automated curve tracer can still be useful. However, where control of a significant number of pins is required, the use of ATE or production test equipment is increasingly indicated [11]. The issues of correlation and set-up time for ASIC verification testers make them significantly less effective in this pin count range. In general, the greater the pin count of products, the less effective the lab scale testers become versus production testers. For ultra high pin count devices with more than a thousand pins, ATE is commonly used for all electrical functions as a cost-effective method for all electrical measurement. For FA of a single high-volume product, the usefulness of the ASIC verification tester may extend well beyond this pin count range. For diverse product mixes, they tend to become limited at lower pin counts.
High-temperature LTCC assembly and design of SiC BJT-based negative charge pump
Published in International Journal of Electronics Letters, 2022
Sajib Roy, Khandokar Asif Faruque, Affan Abbasi, Alan Mantooth
The reticle-21, with a transistor current gain of 104, was selected to measure the variation of the current gain across temperature. The transistor’s temperature characterisation was carried out on the SignatoneTM probe-station. It is equipped with a thermal chuck (capable of reaching 525°C) and chiller to elevate/regulate the temperature of the device under test. The probe tips and arms are rated for 600°C. The thermal chuck had vacuum capability, which allowed the SiC test chip and the probe tips to remain fixed during elevated temperature testing. Figure 3 shows the current gain variation across temperature for the SiC NPN bipolar transistor, with emitter dimensions of 40 µm by 15 µm. The current gain is plotted via the KeysightTM B1500 semiconductor curve tracer at different temperatures. The temperature readings were taken from the controller unit connected to the thermal chuck. The probe tips were landed on the transistor bond pads for each temperature readings, and respective DC characterisation sweeps were performed with the curve tracer. Coaxial cables were attached to the probes connected to the source measuring units (SMUs) of the curve tracer.