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Methods of Thin Film Deposition
Published in Fredrick Madaraka Mwema, Tien-Chien Jen, Lin Zhu, Thin Film Coatings, 2022
Fredrick Madaraka Mwema, Tien-Chien Jen, Lin Zhu
AdvantagesSputter deposition can sputter a wide range of materials, including alloys, compounds, or pure elements of metals and non-metals. It is, therefore, possible to generate a wide range of nanomaterials.The target of the sputtering provides a stable, long-lived source of thin film species. The target’s location can be any direction (down, up, or sideways) based on the design of the sputtering system.Through sputtering, the deposition of the target material can conform to the substrate surface’s shape.Sputter deposition systems consist of lower radiant heating as compared to vacuum evaporation.There is a possibility of high utilisation of sputtered materials due to the presence of rotatable cylindrical magnetrons which confine the plasma to the surface of the substrate. As such, most of the sputtered atoms can reach the surface of the substrate with minimum loss.Preparation of the surface of the substrate can easily be incorporated in situ with the deposition process.
Physical Vapor Deposition
Published in Eiichi Kondoh, Micro- and Nanofabrication for Beginners, 2021
Sputter deposition or sputtering is another PVD method. A plasma is generated using gases, such as Ar, and ions in the plasma are extracted and irradiated to an ingot of source material, so called the target. The Ar ions sputter (described later) the target particles that are incident on the substrate placed opposite to the target. Sputter deposition is a representative PVD method comparable to vacuum evaporation and is widely used for the deposition of various metals, alloys, semiconductors, and compounds.
Deposition Methods
Published in Andrew Sarangan, Optical Thin Film Design, 2020
DC sputter deposition uses a DC power supply to energize the plasma. As a consequence, only electrically conductive materials can be used as targets. The negative terminal of the power supply is attached to the cathode, and the positive terminal is tied to ground. This allows positive gas ions to be drawn toward the cathode and produces sputtering. The cathode terminal is typically much smaller in size than the anode (chamber walls). This size difference will make the electric field strength at the cathode to be much greater than that at the anode. As a result, most of the plasma power will be discharged near the cathode.
Analysis of Crystallization Fouling Durability of Novel Heating Elements for Electric Water Heating
Published in Heat Transfer Engineering, 2022
Alexander Janzen, Eugeny Y. Kenig
Sputter deposition is a physical vapor deposition method that involves thin film deposition through the sputtering process. This involves a plasma jet approaching an ejecting material (the so-called target) which, in turn, emits material ions onto a substrate, as discussed in [4]. The sputtered ions can fly ballistically from the target in straight lines and impact energetically on the substrates. Sputtering is one of the main processes of manufacturing optical waveguides [5]. Furthermore, thin film heaters are widely used in various fields of electronics and microelectronics applications, which are manufactured by physical vapor deposition and chemical vapor deposition processes, as presented in [6] and [7]. Both coating technologies provide new possibilities for use of electrically insulated and conducted coating layers to develop electric heating elements that have better properties than conventional heating elements.