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Microchips and Methods for the Characterization of Thermoelectric Transport Properties of Nanostructures
Published in D. M. Rowe, Materials, Preparation, and Characterization in Thermoelectrics, 2017
Friedemann Völklein, Daniel Huzel, Heiko Reith, Matthias Schmitt
To perform thermoelectric measurements on nanowires and FEBID nanostructures, their integration in specific microchips is required. One important demand for this nano-micro-integration process is the formation of reliable electrical contacts, which do not influence the thermoelectric properties of the nanostructures (e.g., by diffusion processes). To obtain electrical contacts and measuring devices for nanostructures such as nanowires or FEBID/FIBID lines two different approaches are commonly used:The nanostructure is (randomly) placed on a substrate and the measuring device is realized around the nanostructure by micropatterning, especially by using the technologies of surface micromachining. This approach includes the direct formation of electrical connections to the nanostructures as part of the construction of the measuring device.Specific microchips are produced (preferably) by standard semiconductor batch-process fabrication and the nanostructures are placed onto the chips by particular handling and deposition techniques afterwards. Insufficient electrical connections to the prefabricated microchips have to be improved by additional measures.
The Impact of the Internet of Things (IoT) on the IT Security Infrastructure of Traditional Colleges and Universities in the State of Utah
Published in Claire A. Simmers, Murugan Anandarajan, The Internet of People, Things and Services, 2018
In the next few years, billions of objects will be embedded with microchips, RFID tags, and sensors. It is essential that educational institutions implement a layered defense strategy—deter, detect, deny, delay, and defend to prevent unauthorized access, manipulation, and control of IoT devices. “A defense-in-depth strategy is based on the idea that people, technology, and operational security must be provided to ensure end-to-end defense” (Chap-ple & Seidl, 2015, p. 197). These strategies must include the protection of PII, network segmentation, and physical and network security convergence.
Flat-end mill machining analysis of processed CrMnFeCoNi high-entropy alloys
Published in Materials and Manufacturing Processes, 2023
Naresh Kaushik, Anoj Meena, Harlal Singh Mali
After machining at different machine parameters, tool and workpiece surface geometries were analyzed under a stereo microscope (40× zoom). Figure 8(a,b) show the blunt edges of 4 flutes, 10 mm and 8 mm tungsten carbide tools. Broken edges can be observed at primary and secondary cutting edges. Tool marks can be observed in Fig 8(c). Burrs and dents can be observed on the workpiece surface in Fig. 8(d). Microchips were formed during machining, causing micro pits at the surface of the alloy. The friction caused by the chip and tool interface has generated micro-heat-affected zones (m-HAZ). m-HAZ produced during machining can be reduced by the minimum quantity lubrication (MQL) phenomenon. It is the discrete flow of compatible viscous fluid through the nozzle in mist form.[31] Micromachining has produced discrete chip formation as a benefit criterion. The size of the microchips varies from 10 µm to 500 µm. MQL helps heat dissipation from the workpiece surface through microchips resulting in better surface texture.
Drop Evaporation on Rough Hot-Spots: Effect of Wetting Modes
Published in Heat Transfer Engineering, 2020
Huacheng Zhang, Yutaku Kita, Dejian Zhang, Gyoko Nagayama, Yasuyuki Takata, Khellil Sefiane, Alexandros Askounis
Electronic microchips are becoming more densely integrated due to miniaturization. However, increasing the density of the microchips has resulted in greater local generation of heat, also known as hot-spots, that cannot be removed with conventional air-cooling methods [1, 2]. Drop evaporation is capable of removing large amounts of heat and has been proposed in emerging cooling technologies [3–7]. However, the evaporation process of drops on hot-spots is far from understood as it is a complex problem combining the non-trivial issues of evaporation dynamics and wetting of drops which may be influenced by parameters such as surface softness [8] or surface roughness [9, 10] with the heating power effect of the hot-spots [11]. In what follows, we will mainly focus on the role of surface roughness on the evaporation process and the contact line (CL) motion kinetics of drops on rough, hydrophobic hot-spots.