China
Africa
Explore chapters and articles related to this topic
Microstructure of textured ZnS thin films produced by electrostatic spray assisted vapour deposition
Published in A G Cullis, J L Hutchison, Microscopy of Semiconducting Materials 2001, 2018
Recently a novel and cost-effective deposition technique called electrostatic spray assisted vapour deposition (ESAVD) has been developed by Choy (1998) to synthesise various nanocrystalline films on different substrates in an open atmosphere. The process involves spraying atomised precursor droplets across an electric field, where the charged droplets undergo decomposition and/or chemical reactions in vapour phase near the vicinity of the heated substrate. This produces a stable solid film with excellent adhesion onto the substrate. In this paper, we use the ESAVD method to deposit semiconductive ZnS thin films on both glass and Si (100) substrates. The microstructures of both types of film were characterised by x-ray diffraction (XRD) and transmission electron microscopy (TEM) so that the texture natures of both films were revealed.
Thermal efficiency enhancement using a ceramic coating on the cylinder liner and the piston head of the IC engine
Published in International Journal of Ambient Energy, 2021
P. Anand, D. Rajesh, M. Shunmugasundaram, I. Saranraj
The metal substrate is typically a high-temperature aluminium alloy that is either in a single crystal or polycrystalline form. The metallic bond coat is an alloy typically with the composition of nickel, cobalt, chromium and aluminium. The bond coat creates a bond between the ceramic coat and substrate (Thring 1986). The third coat is the ceramic topcoat, zirconia (ZrO2), mullite (3Al2O3–2SiO2), alumina (Al2O3) which is desirable for having very low conductivity while remaining stable at nominal operating temperatures typically seen in applications. This layer creates the largest thermal gradient of the thermal barrier coating. In industry, thermal barrier coatings are produced in a number of ways. Electron Beam Physical Vapour Deposition (EBPVD).Air Plasma Spray (APS).Electrostatic Spray Assisted Vapour Deposition (ESAVD).Direct Vapour Deposition.