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Wideband RF Technologies for Wearable Communication Systems
Published in Albert Sabban, Wearable Systems and Antennas Technologies for 5G, IOT and Medical Systems, 2020
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers and hybrid circuits. The technology is also used for multi-layer packaging for the electronics industry, such as military electronics. Co-fired ceramic devices are made by processing a number of layers independently and assembling them into a device as a final step. Co-firing can be divided into low-temperature (LTCC) and high-temperature (HTCC) applications: low temperature means that the sintering temperature is below 1000°C (1830°F), while high temperature is around 1600°C (2910°F). There are two types of raw ceramics to manufacture multi-layer ceramic (MLC) substrate:Ceramics fired at high temperature (T ≥ 1500°C) – HTCC,Ceramics fired at low temperature (T ≤ 1000°C) – LTCC.
Microwave Technologies for Wearable Communication Systems
Published in Albert Sabban, Novel Wearable Antennas for Communication and Medical Systems, 2017
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for multilayer packaging for the electronics industry, such as for military electronics. Co-fired ceramic devices are made by processing a number of layers independently and assembling them into a device as a final step. Co-firing can be divided into low temperature (LTCC) and high temperature (HTCC) applications: low temperature means that the sintering temperature is below 1,000°C (1,830°F), while high temperature is around 1,600°C (2,910°F). There are two types of raw ceramics to manufacture multilayer ceramic (MLC) substrate: Ceramics fired at high temperature (T ≥ 1500°C): high-temperature co-fired ceramic (HTCC)Ceramics fired at low temperature (T ≤ 1000°C): low-temperature co-fired ceramic (LTCC).
Improving the sintering performance and dielectric properties of thermally conductive low-temperature co-fired alumina by controlling the firing atmosphere
Published in Journal of Asian Ceramic Societies, 2022
Koichi Shigeno, Takumi Nagata, Hirotaka Fujimori
Alumina (Al2O3) has a high thermal conductivity, high physical strength, and excellent dielectric properties [1–5], and it is therefore widely used to fabricate electronic components, such as wiring substrates and integrated circuits (IC) packages. However, in general, the sintering temperature of pure alumina, even in fine powder form, is approximately 1400°C or higher, which is not preferable for energy saving and realizing a carbon-neutral society. Furthermore, co-fired conductor materials must have a high melting point, such as that of W or Mo, resulting in high electrical resistance. The ceramics that can be fired together with low-resistance conductor materials, such as Ag (melting point of 961°C) or Cu (melting point of 1084°C), are called low-temperature co-fired ceramic (LTCC) materials [6–10]. Because LTCC materials allow the fabrication of several electrical components, including built-in capacitors, inductors, and low-loss transmission lines, they are widely used for producing high-frequency modules. However, LTCC materials must contain large amounts of glass in alumina (approximately 50–60% of the total weight) to achieve low-temperature sintering; hence, the majority of these materials exhibit several limitations, such as low thermal conductivities.
A review on wireless sensors fabricated using the low temperature co-fired ceramic (LTCC) technology
Published in Australian Journal of Mechanical Engineering, 2021
Co-fired ceramics were first developed in the late 1950s to the 1960s. The technology was used to manufacture high-capacitycapacitors in the early stage, and later expanded to include multilayer printed circuit board structures in the 1960s. The co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Low temperature means that the ceramic sintering temperature is lower than 1000°C compared to the high temperature of around 1600°C of alumina-based HTCC technology. The LTCC technology can produce three-dimensional ceramic structures with embedded circuits, inductors, resistors, transformers, microchannel elbows and cavities. In particular, the good mechanical and electrical properties of LTCCs, as well as the compatibility with thick-film hybrid technology, make them particularly suitable for integrated sensors and radio frequency applications. (Nowak and Dziedzic 2011)