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Electrical Design, Simulation, and Testing
Published in Fred D. Barlow, Aicha Elshabini, Ceramic Interconnect Technology Handbook, 2018
Daniel I. Amey, Kuldeep Saxena
Thermal performance has always been a significant factor in the choice of materials for electronic packaging; however, new demands are being placed on packages and interconnecting substrates. In wireless communication applications, the stability and uniformity of electrical properties over broad frequency and operating temperature ranges are critical. Until the advent of wireless communications, there were few high-volume applications of ceramic materials; ceramic was primarily used for its proven high reliability, high density, semiconductor process compatibility, environmental performance (hermeticity), and thermal properties. High-volume wireless module designs, such as Bluetooth, have been implemented in LTCC for the excellent combination of properties offered by LTCC, and the overall cost has been shown to be lower than FR4 PWB equivalents.
Printed Wiring Boards
Published in Jerry C. Whitaker, Electronic Systems Maintenance Handbook, 2017
Ravindranath Kollipara, Vijai Tripathi
Printed wiring board (PWB) is, in general, a layered dielectric structure with internal and external wiring that allows electronic components to be mechanically supported and electrically connected internally to each other and to the outside circuits and systems. The components can be complex packaged very large-scale integrated (VLSI), RF, and other ICs with multiple I/Os or discrete surface mount active and passive components. PWBs are the most commonly used packaging medium for electronic circuits and systems. Electronic packaging has been defined as the design, fabrication, and testing process that transforms an electronic circuit into a manufactured assembly. The main functions of the packagings include signal distribution to electronic circuits that process and store information, power distribution, heat dissipation, and the protection of the circuits.
Summary
Published in Mitel G. Pecht, Rakesh Agarwal, Patrick McCluskey, Terrance Dishongh, Sirus Javadpour, Rahul Mahajan, Electronic Packaging: Materials and Their Properties, 2017
Mitel G. Pecht, Rakesh Agarwal, Patrick McCluskey, Terrance Dishongh, Sirus Javadpour, Rahul Mahajan
The ever-increasing demands placed on electronic devices with respect to performance, reliability, manufacturability, and cost challenge the capabilities of packaging materials in terms of their properties. New materials with advanced and often tailored properties are finding multiple applications at various levels of electronic packaging. However, with the use of these materials comes the added responsibility of assessing the manufacturing and reliability issues associated with them and their interfaces. Success in the area of electronic packaging begins with the proper choice of packaging material, based on an understanding of the material’s behavior and the influence of environmental and operating conditions on the material’s properties. Experimental characterization, numerical simulation, and analytical modeling of materials are all fundamental to the proper utilization of electronic packaging materials.
BNNS formation through surface modification of hBN nanopowders with a silane coupling agent
Published in Journal of Dispersion Science and Technology, 2023
Levent Koroglu, Erhan Ayas, Nuran Ay
Followed by the development of polymer matrix nanocomposites, it is seen that the addition of nanofillers created an interaction between filler and matrix that quietly improved properties compared to traditional composites.[16] Notably, the reinforcement of 2D nanosheets promoted the performance of nanocomposites due to their high surface area, large radius-to-thickness ratio, and superior physical properties.[17] BNNSs were used in polymer nanocomposites to enhance mechanical strength, thermal conductivity, electrical resistivity, and breakdown strength (discharged energy density). The most promising applications include electronic packaging, sensors, and energy storage.[18,19] However, there are some challenging points to focus on, such as the dispersion of BNNSs into polymer matrix and the production of BNNSs from nano-sized hBN powders by exfoliation, which are discussed below.
Evaluation of the microstructure and thermal properties of (ASTM A 494 M grade) nickel alloy hybrid metal matrix composites processed by sand mold casting
Published in International Journal of Ambient Energy, 2022
J. Kumaraswamy, Vijaya Kumar, G. Purushotham
Experimental work has shown that adding titanium dioxide particles together with the introduction of aluminium oxide shows an analogous effect. Increasing the proportion of titanium dioxide particles has been observed to have contributed to grain refining. It was claimed in the literature that the aluminium particles were nucleated consistently on the basis of the aluminium oxide distribution. It has been stated in the literature that greater particles of aluminium oxide were required in the high volume fraction of the composites. Particles of aluminium oxide were distributed homogeneously, and the particles of aluminium oxide occupy the interstitial positions around the course particles. Due to the improved mechanical resistance and high thermal conductivity, it has been found that a lightweight and uniform microstructure is advantageous for electronic packaging products.
Non- oil bleed two-part silicone dispensable thermal gap filler with Al2O3 and AlN filler for effective heat dissipation in electronics packaging
Published in The Journal of Adhesion, 2022
Vigneshwarram Kumaresan, Srimala Sreekantan, Mutharasu Devarajan, Khairudin Bin Mohamed
Thermal management in electronic packaging assemblies is critical because it affects the performance, lifetime, and reliability of electronic packaging devices.[1] Thermal interface materials (TIMs) play a critical role in electronics thermal management by providing a low thermal impedance path between the over-mold of the component and the heat sink.[2] A thermal interface material (TIM) is placed between a heat-producing device (e.g., an integrated circuit) and a heat-dissipating device (e.g., a heat sink, enclosure) to minimize the thermal contact resistance between the components. Due to the rising demand for thermal interface materials, the global TIM market size is expected to reach USD 3.33 billion by 2025, growing at a Compound Annual Growth Rate of 10.8% over the forecast period.[3] Currently, many types of thermal interface materials available on the market that includes: thermal Pads, [1,4,5] dispensable thermal gap filler (liquid thermal interface materials), [6] thermally conductive adhesive tapes, [7,8] phase change materials, [9,10] greases or thermal compounds,[11] and thermal paste.[12,13]