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Semiconductor Failure Modes
Published in Jerry C. Whitaker, Electronic Systems Maintenance Handbook, 2017
The mechanical assembly process is critical to the ultimate reliability of the device. The die is bonded to the package of lead frame using eutectic, an epoxy compound, or some other suitable medium. The strength (or adhesion) of the die to the package is an important concern because a poorly attached die could lift later as a result of vibration. After attachment, the die is electrically connected to the package leads by bonding aluminum or gold wires to each bonding pad on the die and then to the respective package lead posts. Attachment of the lid completes the mechanical assembly. The device may be hermetically sealed (for military-grade products) using glass, solder, or welding techniques, or encapsulated (for commercial-grade devices) in plastic or epoxy.
Ceramic Packaging of Integrated Circuits
Published in Lionel M. Levinson, Electronic Ceramics, 2020
The microelectronics era began in earnest in 1955 with the development of diodes and transistors. These devices had to be hermetically sealed to avoid contamination from moisture and impurities, which could affect their performance. In Fig. 3, the first glass-metal sealed headers for diodes and transistors are shown. The early ceramic flat packs are depicted in Fig. 4, which were also used to package diodes and transistors.
Humidity and Corrosion Analysis and Design
Published in Michael Pecht, Handbook of Electronic Package Design, 2018
Hermetically sealed packages are tested to detect package sealing defects such as improperly formed seals, improperly sealed lids, and cracks and holes in the seals. Early detection and correction of leaks in hermetic packages will keep potential corrosion-related defects from becoming reliability problems.
Design, Analysis and Validation of MCP Package for GaAs Monolithic Microwave Integrated Circuits Packaging
Published in IETE Journal of Research, 2022
Ravi Gugulothu, Sangam Bhalke, Lalkishore K, Ramakrishna Dasari
The design of multistage amplifiers usually consists of the optimization of high gain, overall low noise figure and overall high power. For this, all-interconnecting stages should be properly designed and optimized to match a 50ohm resistance. Multichip module (MCM) configuration is shown in Figure 16. A 20 dB gain identical MMIC was selected in two stages to meet the more than 35 dB gain. An internal 3 dB thermo-pad is used for better interstage matching and gain compensation to 35 dB application with no drift over an environmental test condition. This MCM package should meet the hermiticity requirement. The package is hermetically sealed by using the resistive welding technique in an inert environment as per the specification space standards. Presently various multichip module techniques are available in a 3D packaging manner. LTCC is an advanced 3D packaging technique used in the industry for microwave and millimetre wave integrated circuits packaging. This technique has the non-compliance issues of meeting the leak rate specifications when used for multichip packaging in a single cavity. Hence, proposed a package with a Kovar seal ring suitable for resistive welding meeting the fine leak as well as gross leak specifications as per mil-std-883 and accommodating 35 dB gain.