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Basics of Amplifiers
Published in Amir M. Sodagar, Analysis of Bipolar and CMOS Amplifiers, 2018
Different implementations for amplifiers will be studied in Chapter 4. It will be seen that the amount of the gain that each amplifier is capable of providing is limited. In addition, none of the amplifier configurations can exhibit a good gain and excellent input and output resistances at the same time. As will be extensively studied in Chapter 5, in most applications, it is preferred to cascade two or more amplifiers to obtain the desired performance. Figure 1.17 illustrates a cascade of N amplifier stages. In multistage amplifiers, each stage amplifies the signal and delivers it to the next stage. When studying the amplification by the i-th stage, the (i – 1)-th stage performs as the signal source, and the (i + 1)-th stage is considered as the load. The easiest way to analyze each stage is to model the previous stage by its Thevenin or Norton equivalent circuit, depending on whether the signal is a current or a voltage, and represent the next stage by only a resistance as the load. This is illustrated in Figure 1.18.
CMOS Amplifiers
Published in Tertulien Ndjountche, CMOS Analog Integrated Circuits, 2017
In the multistage amplifier design approach, the requirement of a high gain is met by combining a differential stage and extra output stages. Various architectures are available for the implementation of output stages, which should be designed to provide an adequate level of the signal power to the amplifier load. The output stage should exhibit a lower output resistance to drive the load as if it were an ideal voltage source.
Technology for Telecommunications: Optical Fibers, Amplifiers, and Passive Devices
Published in Iannone Eugenio, Telecommunication Networks, 2017
Almost all line amplifiers and several boosters and preamplifiers are in fact multistage amplifiers with two or even three stages. Two-stage amplifiers can be designed in several ways, as an example, a possible scheme is provided in Figure 4.19.
Design, Analysis and Validation of MCP Package for GaAs Monolithic Microwave Integrated Circuits Packaging
Published in IETE Journal of Research, 2022
Ravi Gugulothu, Sangam Bhalke, Lalkishore K, Ramakrishna Dasari
The design of multistage amplifiers usually consists of the optimization of high gain, overall low noise figure and overall high power. For this, all-interconnecting stages should be properly designed and optimized to match a 50ohm resistance. Multichip module (MCM) configuration is shown in Figure 16. A 20 dB gain identical MMIC was selected in two stages to meet the more than 35 dB gain. An internal 3 dB thermo-pad is used for better interstage matching and gain compensation to 35 dB application with no drift over an environmental test condition. This MCM package should meet the hermiticity requirement. The package is hermetically sealed by using the resistive welding technique in an inert environment as per the specification space standards. Presently various multichip module techniques are available in a 3D packaging manner. LTCC is an advanced 3D packaging technique used in the industry for microwave and millimetre wave integrated circuits packaging. This technique has the non-compliance issues of meeting the leak rate specifications when used for multichip packaging in a single cavity. Hence, proposed a package with a Kovar seal ring suitable for resistive welding meeting the fine leak as well as gross leak specifications as per mil-std-883 and accommodating 35 dB gain.