China
Africa
Explore chapters and articles related to this topic
Dynamic Thermal Optimization for 3D Many-Core Systems
Published in Aida Todri-Sanial, Chuan Seng Tan, Krzysztof Iniewski, Physical Design for 3D Integrated Circuits, 2017
Nizar Dahir, Ra’ed Al-Dujaily, Terrence Mak, Alex Yakolev
A typical modern chip package consists of several layers. Figure 12.9 illustrates these layers for a typical ceramic ball grid array (CBGA) package of a 3D-IC with four vertically stacked silicon dies. This is the packaging scheme adopted in this chapter. The package has several heat conduction layers including heat sink, heat spreader, thermal paste, silicon die(s), C4 pads, ceramic packaging substrate, and solder balls [22]. These layers are designed in such a way as to maximize the heat-flow from the active layer(s), or silicon die(s), to the ambient. This path represents the primary heat-flow in the package. Thus, the heat generated by chip activity could be removed efficiently.
Thermal energy harvesting from asphalt pavement roadways
Published in Andreas Loizos, Imad L. Al-Qadi, A. (Tom) Scarpas, Bearing Capacity of Roads, Railways and Airfields, 2017
Utpal Datta, Samer Dessouky, A.T. Papagiannakis
The TEG generates power as a result of the temperature gradient between its top and bottom surfaces. Inadvertently, some the heat conveyed from the top to the bottom is minimizing the temperature gradient and output voltage. If this heat is not dissipated effectively from the bottom side, it will minimize the efficiency of the prototype. Therefore, a custom designed heat sink was developed. The aluminum heat sink used in the prototype is 300 mm (H) × 150 mm (W) × 115 mm (D) (Fig. 4b). The inner chambers of the heat sink can be filled with a heat dissipating fluid, such as water. After sealing it properly, the heat sink is glued under the bottom surface of the TEGs with highly conductive thermal paste. The heat sink maintains the TEGs bottom surface temperature as close as the surrounding soil. Hence a steady temperature gradient is ensured to maximize the power generation.
Development and thermodynamic analysis of a novel heat pipe vacuum tube solar collector with sensible heat storage
Published in Energy Sources, Part A: Recovery, Utilization, and Environmental Effects, 2023
Anshul Sachdeva, Chandrashekara M., Avadhesh Yadav
It is found from the literature that researchers have worked on increasing the performance and efficiency of HPVT solar collector using both experimental and numerical techniques. For the same, various approaches have been adopted but no work has been reported to enhance the thermal performance of HPVT solar collector by controlling thermal resistance between the condenser section of copper heat pipe and HTF due to the thermal paste. The existing HPVT solar collectors require application of thermal paste between the condenser or heat dissipating section of heat pipe and manifold which has limited durability. Thermal paste is required to be replaced periodically as the thermal resistance between condenser section and HTF increases as it deteriorates over time. To eliminate the application of thermal paste, the authors have developed and proposed a HPVT solar collector incorporating a new header where HTF gains heat directly in contact with the condenser section. This hot HTF can be guided to a heat exchanger for some heating application. The complete fabrication process is presented in this paper explicitly to encourage entrepreneurship. Moreover, the developed system has been studied experimentally to evaluate its thermal performance using energy and exergy analysis. The useful energy and exergy gain, energy and exergy efficiency of the system in three consecutive months have been evaluated, compared, and presented in the manuscript.
Synergistic effect of active-passive methods using fins surface roughness and fluid flow for improving cooling performance of heat sink heat pipes
Published in Experimental Heat Transfer, 2023
Toktam Ghazi, Mohammad Reza Attar, Amirhossein Ghorbani, Hadeer Alshihmani, Ali Davoodi, Mohammad Passandideh-Fard, Mohammad Sardarabadi
To reduce the thermal resistance in both cooling modules, a thermal paste (thermal grease) fills the air gaps between the PCB, copper plate, and the HSHP. A power supplier (DC, 30 V/5A) that generates a uniform heat flux of 4000 to 12,000 W/m2 is connected to the PCB. A 0.5 mm, copper plate located between the HSHP and the PCB, ensures a heat flux with a uniform distribution. Four same K-type thermocouples are prepared to measure temperature at four different points. One is to measure the PCB temperature, located between the copper plate and the PCB. Two of them are employed to measure the coolant’s inlet and outlet bulk temperatures. The last thermocouple is to measure the ambient temperature. Based on Figure 2, a data logger (Lutron TM-947SD) is used to display all K-type thermocouples values. An SD card is put in the data logger to save the corresponding data with a 20-s time step.
Non- oil bleed two-part silicone dispensable thermal gap filler with Al2O3 and AlN filler for effective heat dissipation in electronics packaging
Published in The Journal of Adhesion, 2022
Vigneshwarram Kumaresan, Srimala Sreekantan, Mutharasu Devarajan, Khairudin Bin Mohamed
Thermal management in electronic packaging assemblies is critical because it affects the performance, lifetime, and reliability of electronic packaging devices.[1] Thermal interface materials (TIMs) play a critical role in electronics thermal management by providing a low thermal impedance path between the over-mold of the component and the heat sink.[2] A thermal interface material (TIM) is placed between a heat-producing device (e.g., an integrated circuit) and a heat-dissipating device (e.g., a heat sink, enclosure) to minimize the thermal contact resistance between the components. Due to the rising demand for thermal interface materials, the global TIM market size is expected to reach USD 3.33 billion by 2025, growing at a Compound Annual Growth Rate of 10.8% over the forecast period.[3] Currently, many types of thermal interface materials available on the market that includes: thermal Pads, [1,4,5] dispensable thermal gap filler (liquid thermal interface materials), [6] thermally conductive adhesive tapes, [7,8] phase change materials, [9,10] greases or thermal compounds,[11] and thermal paste.[12,13]