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Multichip Modules
Published in Fred W. Kear, Hybrid Assemblies and Multichip Modules, 2020
Heat sinking and heat dissipation. Heat sinking is a term usually applied to the thermal conduction achieved by having contact with the heat source. The heat sink, in some cases, may retain the energy that it absorbs from the heat source. In other cases, it may transfer this energy elsewhere, either by conduction or by convection. There is obviously some heat sinking in the typical MCM structure. In many cases, the heat sink, in turn, becomes a radiator of heat. The efficiency with which the heat sink radiates the heat will depend on its conductivity, geometry, and surface finish. Heat sinks may make up a portion of the MCM final package if the designer elects to do this.
Nonlinear Algebra
Published in Brian Vick, Applied Engineering Mathematics, 2020
Heat sinks are often attached to electronic devices to increase the cooling efficiency and thereby lower the temperature of the device. One common configuration of these heat sinks is an array of pin fins. Given the overall dimensions of a heat sink consisting of pin fins, it is desirable to know the optimal fin spacing, Sopt. The empirical formula for the optimal spacing is (SoptD)2+Sopt/D(1+Sopt/D)2/3=2.75(HD)1/3Ra−1/4
Introduction
Published in Srikanth Rangarajan, C. Balaji, Phase Change Material-Based Heat Sinks: A Multi Objective Perspective, 2019
Srikanth Rangarajan, C. Balaji
Heat sinks were termed as a passive type heat exchanger. The advent of heat sinks can be dated back to the early 1930s. Heat sinks facilitate the heat generating elements to dissipate heat into them by providing more heat transfer surface.
Multi-Objective Optimization of Hybrid Heat Sinks with Phase Change Materials
Published in Heat Transfer Engineering, 2023
Muthamil Selvan Nedumaran, Govindappa Trilok, Nagarajan Gnanasekaran, Kamel Hooman
The miniaturization of electronic devices has increased thermal stress, making compact cooling techniques essential. Conventional heat sinks provide the desired compactness to operate the devices under safety limits. Heat sinks absorb heat from the devices and dissipate heat to the surrounding so that the reliability of the device is enhanced. A passive type of heat sink is filled with phase change material (PCM). PCM by phase conversion can store heat energy. When the PCM absorbs the heat, it converts from a solid to a liquid state. When the heat is extracted from the PCM, it reforms to a solid state. PCM has numerous advantages, but the major drawback is poor thermal conductivity. This high resistance can be overcome by adding some enhancers and these enhancers increase the heat flow within the sink. Several enhancers like fins [1–5], foams [6–10], nano additives [11–15], and heat pipes [16–18] have been used in recent years.
Sensitivity of pin-fin configuration to pin diameter: heat transfer enhancement
Published in Chemical Engineering Communications, 2023
Yacine Khetib, Ahmad Alahmadi, Ali Alzaed, S. Mohammad Sajadi, Roozbeh Vaziri, Mohsen Sharifpur
The use of mathematical methods in modeling many phenomena can be traced (Alizadeh et al. 2020; Mesgarpour et al. 2021; Motamedi 2020; Motamedi et al. 2013; Motamedi and Esfandiarpour 2019). The main purpose of heat sinks is to keep the electronic device away from the damaging effects of temperature (Salimpour et al. 2017). Therefore, to check how the heat sinks work, it is very important to determine the temperature distribution inside. The temperature distribution is obtained by numerically solving the energy equation (Karimipour et al. 2021). ; Nguyen et al. 2020; Solving the energy/momentum equations including nanofluid has been studied by many researchers (Giwa et al. 2020a, 2020b; Jahangir et al. 2018; Mahdavi, Garbadeen, et al. 2019; Mostafa, Sharifpur, et al. 2019; Menni et al. 2020):
Geometrical effects of pins in a center cleared heat sink on thermal management of electronic systems
Published in Numerical Heat Transfer, Part A: Applications, 2023
Ayush Tiwari, Anil Kumar Patil, Manoj Kumar
Heat sinks play a crucial role in heat dissipation from electronic components for the safe and efficient operations of devices. The selection of fin geometry is equally important as the material due to its contribution to forming the boundary layer around the heat sink. The fin profile and their arrangements have shown significant effects on effectiveness in dissipating heat energy, particularly in natural convection. The designers have preferred cylindrical pin fin heat sinks in many cooling applications due to high heat transfer performance and minimal effect on fluid flow patterns [1, 2]. The solid cylindrical pin fin geometry was modified by making it hollow and introducing the perforations. Elshafei [3] evaluated the thermal characteristics of perforated hollow pin fins in the staggered arrangement under natural convection. An upward-facing heat sink with a higher diameter ratio of solid pin fin provided the maximum value of heat transfer coefficient.