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Principles and Methods for Integration of Carbon Nanotubes in Miniaturized Systems
Published in Anupama B. Kaul, Microelectronics to Nanoelectronics, 2017
A. John Hart, Sei Jin Park, Michael F.L. de Voider, Sameh H. Tawfick, Eric R. Meshot
As the sizes of microelectronic circuits and devices continue to scale down and their power increases, efficient thermal management becomes more crucial. Since mating two rigid surfaces together is inherently limited by finite surface roughness (Figure 8.14a), an effective thermal interface material (TIM) is desirable for minimizing thermal contact resistance between the device and heat sink to maximize thermal dissipation. A good TIM therefore fills the gaps between contacting surfaces and provides high thermal conductivity (Gwinn and Webb, 2003).
Dynamic Thermal Optimization for 3D Many-Core Systems
Published in Aida Todri-Sanial, Chuan Seng Tan, Krzysztof Iniewski, Physical Design for 3D Integrated Circuits, 2017
Nizar Dahir, Ra’ed Al-Dujaily, Terrence Mak, Alex Yakolev
For thermal model configuration, layer die thickness is set to 0.15 mm. The thermal resistivity of the heat sink is 0.0025 m K/W. The dies are separated by an interlayer material with a thickness of 0.02 mm. The heat spreader is placed on top of the silicon dies. The thermal interface material (TIM) is used as the filler material in order to separate the heat spreader and the silicon dies. The resistivity of the interlayer material is set to 0.25 m K/W. Ambient temperature is assumed to be 25°C. VDD and frequency are assumed to be 1 V and 3 GHz, respectively.
Simulation design for thermal model from various materials in electronic devices: A review
Published in Numerical Heat Transfer, Part A: Applications, 2022
Raihana Bahru, Mohd Faiz Muaz Ahmad Zamri, Abd Halim Shamsuddin, Mohd Ambri Mohamed
Another researcher developed a model for thermal conductivity measurement is Karthick et al. [16] by applying TIM in TEG system. They used silicon grease and silicon oil as a base with nanoparticles of MWCNTs and copper. The analysis was conducted for the open and closed circuit where an increase of power and voltage outputs for thermal conductivities achieved 0.6 W/mK. Meanwhile, there is less impact on outputs of the TEG system to 0.9 and 4.2 W/mK. The COMSOL simulation gives in agreement data with experimental as the open-circuit voltage range 0.3–2.6% and 0.5–3.1% for power output. Mainly, TIM is contributed to improve the performance of TEG system by 10–20%. Besides, TIM also contributed more than 0.6 W/(m.K) significant improvement to the TEG system for thermal conductivity. Hence, the study was not suggested implementing the expensive MWCNT and Cu NPs as TIM in the TEG system.
Through Plane Networked Graphene Oxide/Polyester Hybrid Thermal Interface Material for Heat Management Applications
Published in Nanoscale and Microscale Thermophysical Engineering, 2022
The fundamental reason for using TIM is to fill in the asperities that exist between the two solid contacts to ensure efficient heat conduction between the heat sink and heat-producing devices. Hence, it is essential that the fabricated TIM shows flexibility and softness [9]. Figure 6(a) demonstrates the flexibility of N-GOPET TIM, which is obvious considering the use of the fibrous textile substrate. The fabricated TIM should also be able to form different shapes to ensure its usability in devices with different shapes and sizes. The cuttability of N-GOPET TIM into different shapes is demonstrated in Figure 6(b), indicating its usability in devices of different shapes and sizes. The results suggest that an N-GOPET-based TIM can be a potential replacement for commercially available grease-based TIM overcoming its limitations in terms of performance and reusability.
Non- oil bleed two-part silicone dispensable thermal gap filler with Al2O3 and AlN filler for effective heat dissipation in electronics packaging
Published in The Journal of Adhesion, 2022
Vigneshwarram Kumaresan, Srimala Sreekantan, Mutharasu Devarajan, Khairudin Bin Mohamed
Thermal management in electronic packaging assemblies is critical because it affects the performance, lifetime, and reliability of electronic packaging devices.[1] Thermal interface materials (TIMs) play a critical role in electronics thermal management by providing a low thermal impedance path between the over-mold of the component and the heat sink.[2] A thermal interface material (TIM) is placed between a heat-producing device (e.g., an integrated circuit) and a heat-dissipating device (e.g., a heat sink, enclosure) to minimize the thermal contact resistance between the components. Due to the rising demand for thermal interface materials, the global TIM market size is expected to reach USD 3.33 billion by 2025, growing at a Compound Annual Growth Rate of 10.8% over the forecast period.[3] Currently, many types of thermal interface materials available on the market that includes: thermal Pads, [1,4,5] dispensable thermal gap filler (liquid thermal interface materials), [6] thermally conductive adhesive tapes, [7,8] phase change materials, [9,10] greases or thermal compounds,[11] and thermal paste.[12,13]