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Servo Feedback Devices and Motor Sensors
Published in Wei Tong, Mechanical Design and Manufacturing of Electric Motors, 2022
There are several techniques for electronics cooling including various styles of heatsinks, cold plates, forced air-cooling systems, impinging jets, immersion cooling techniques, heat pipes, and others. Each of these options varies in cooling efficiency, complexity, cost, and heat dissipating capacities. For servo drives, heatsinks are often used in combination with fans to keep the electronic components of the drive in an acceptable temperature range and prevent them from overheating. Thermoelectric devices are promising technology toward effective electronic cooling. There have been many attempts to use thermoelectric devices to cool electronic devices with various types of heatsinks. It has been reported that pulsed thermoelectric cooling for computer chips could achieve a background heat flux of 40 W/cm2 and a hotspot heat flux of 1,000 W/cm2 [8.71].
Alternative and Hybrid Cooling Systems
Published in Sotirios Karellas, Tryfon C. Roumpedakis, Nikolaos Tzouganatos, Konstantinos Braimakis, Solar Cooling Technologies, 2018
Sotirios Karellas, Tryfon C. Roumpedakis, Nikolaos Tzouganatos, Konstantinos Braimakis
Gordon et al. (2002) proposed a mini-scale combined adsorption thermoelectric chiller. The principle of the proposed scheme operation consists of the exploitation of the heat produced by the thermoelectric effect to drive the desorption of the adsorption cycle. Through these means, the low COP of both cycles can be significantly increased to a value of up to 0.9, according to the authors, at a minimum evaporation temperature of 11°C and a condensation temperature of 35°C. The mini-scale of the system and its high efficiency offers the potential for application in electronics cooling.
Principles of component characterization
Published in Kaveh Azar, in Electronic Cooling, 2020
The primary goal of thermal engineering in electronics cooling is the reduction or control of operating junction temperatures. The measurement of component thermal resistance is a common approach to junction temperature determination given a set of environmental conditions and the component power dissipation. Thermal resistance provides a simple and convenient means for estimating junction temperatures.
Influence of thickness of metal foam on the conduction and convection heat transfer for a flat plate with metal foam impinged by a single circular air jet
Published in Experimental Heat Transfer, 2023
Ketan Yogi, Shankar Krishnan, S.V. Prabhu
The removal of a high heat flux from the surface is a major concern in some applications such as electronics cooling or gas turbine blade cooling. For such applications, the jet impingement technique is extensively used. The heat and fluid flow characteristics of the jet impingement technique are investigated by researchers (Lytle and Webb [1], Ashforth-Frost et al. [2], Narayanan et al. [3], Katti and Prabhu [4], Nirmalkumar et al. [5]) in past. The heat transfer characteristics for a jet impingement on a flat surface depend on the parameters such as Reynolds number, nozzle exit to plate distances, radial distance, Prandtl number, the turbulent intensity at a nozzle exit, jet confinement, and nozzle geometries [6]. Recently, Dhruw et al. [7] investigated the effect of the diameter of the nozzle on the cooling performance of a large targeted plate impinged by a circular air jet. They have reported that a nozzle with a smaller diameter offers less cooling effect compared to a larger diameter of nozzle for the same area on a targeted plate. However, the total heat transfer distribution over the entire targeted plate is the same. Joshi et al. [8] investigate the effect of the nozzle aspect ratio on the local heat transfer of a flat and concave surface. They have reported that the stagnation Nusselt number increases with the increase in the nozzle aspect ratio depending on the nozzle exit to plate distances.
Fan Cooling Investigation for High-Speed Electronic Interconnect
Published in Heat Transfer Engineering, 2023
Taolue Zhang, Qibo Li, Gokul Shankaran, Peerouz Amleshi
The past few decades have seen numerous studies in electronics cooling techniques [1], including natural and forced convection by air, single- and multi-phase liquid cooling. Given the high heat density in the QSFP-DD interconnect, forced air cooling with heat sinks remains a cost-effective and popular thermal solution. Relevant topics of interest in existing literature are fan flow characterization, heat sink optimization, and cooling of electronic interconnects.