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Introduction of Graphene
Published in Abhay Kumar Singh, Tien-Chien Jen, Chalcogenide, 2021
Abhay Kumar Singh, Tien-Chien Jen
Thermal management is one of the key factors for reliable performance of electronic devices at a time when considerable amount of heat is generated during the operation. Since graphene can be a major component in electronic devices in the future due to its high thermal conductivity (up to 5000 W/mK) at room temperature, in the case of single layer defect-free graphene [116]. Their strong CAC covalent bonds and phonon scattering can also contribute in high thermal conductivity performance. It was also reported that the thermal conductivity of pure single-layer graphene is much higher than the past reported thermal conductivity of other carbon allotropes at room temperature, such as carbon nanotubes (3000 W/mK for MWCNT and 3500 W/mK for SWCNT) [118, 119]. The graphene thermal conductivity may also be affected by factors such as defects, edge scattering and isotopic doping [120, 121]. Usually, these factors can harm the conductivity due to phonon scattering at defect and phonons modes localization due to doping.
Characteristic Properties
Published in Satyendra Mishra, Dharmesh Hansora, Graphene Nanomaterials, 2017
Satyendra Mishra, Dharmesh Hansora
Graphene has been envisioned for applications in electronic devices. A thermal management is one of the key factors for better performance and reliability of the electronic components. A considerable amount of heat generates during the device operation which needs to be dissipated. Carbon allotropes such as graphite, diamond and CNTs have already shown higher thermal conductivity due to strong CAC covalent bonds and phonon scattering. CNTs are also known for having the highest thermal conductivity of 3000 W/mK (for MWCNT) at room temperature [69] and 3500 W/mK (for SWCNT) [70]. But, a large thermal contact resistance was the main issue with CNTs-based semiconductor. Recently, the highest thermal conductivity was reported up to 5000 W/mK at room temperature for the single-layer pure defect free graphene, whereas for supported graphene conductivity was reported to be 600 W/mK. Conductivity of the graphene on various supports is needed to be studied much, but their effect was predicted by Klemens [71]. Thermal conductivity was reported within the range of 3000–5000 W/mK at room temperature.
Effect on the Thermal Performance of a Bio-based Phase Change Material with the Addition of Graphite with Surfactants
Published in Heat Transfer Engineering, 2023
Yahya Sheikh, Mehmet Fatih Orhan, Mehmet Kanoglu, Muhammed Umair, Elmehaisi Mehaisi
In recent decades, special attention has been paid to electronic thermal management techniques because effective cooling systems are critical to the performance and reliability of many electronic components. Phase change materials, commonly referred to as PCMs, are materials that have the distinct ability to absorb or release significant quantities of thermal energy at a relatively constant temperature. This is made possible by the large enthalpy of vaporization or heat of fusion values associated with phase change processes. As a result, PCMs are an appropriate material candidate when considering cooling systems. This is especially true during the transient response phase of an electronic system since using a PCM can ensure a constant temperature while simultaneously absorbing thermal energy from the system.
Through Plane Networked Graphene Oxide/Polyester Hybrid Thermal Interface Material for Heat Management Applications
Published in Nanoscale and Microscale Thermophysical Engineering, 2022
Electronic devices play a significant role in our lives and are likely to play an even greater role in the future, given their wide range of applications in every sector [1, 2]. The failure factor of an electronic device increases exponentially with an increase in temperature; hence, the thermal management process is vital to ensure its proper functioning and lifecycle [3, 4]. There are various methods to remove heat from the devices, including using cooling pipes, thermoelectric coolers and heat sink [5]. Among these methods, a combination of a heat sink and cooling fan is the most effective and facile method for heat management applications [1, 6]. The heat from the device is removed by attaching a heat sink; however, due to the solid contact, air pockets exist, this inhibits heat transfer since air is a poor conductor of heat [7, 8]. Thermal interface materials (TIM) fill the air gaps and reduce the interfacial resistance between the heat sink and the heat-producing device, ensuring high heat dissipation to the atmosphere. The continuous rising interest in miniaturization, yet powerful devices are creating more demand for efficient and high conductive TIMs.
Modeling of a three-dimensional dynamic thermal field under grid-based sensor networks in grain storage
Published in IISE Transactions, 2019
Our approach offers deeper insights into the spatiotemporal dynamics in a thermal field, and our simulation and real case studies of thermal field estimation in a grain store indicate that our spatiotemporal model can characterize the temperature field evolution in granaries. The proposed framework and model can be generalized and applied to thermal estimation processes, e.g., air temperature estimation for research on regional weather change, ocean temperature estimation to identify climate variability and global ocean circulation, and land temperature estimation to characterize interactions between the Earths surface and the atmosphere. The proposed model can be also applied to other engineering thermal management systems. For example, developing effective thermal management systems for electronic devices has become a growing need to improve system performance and reduce device failure.