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Surface Features
Published in Wolfgang Osten, Optical Inspection of Microsystems, 2019
As mentioned in the introduction, microcomponents in MEMS/MOEMS and semiconductor devices are primarily fabricated by planar technologies, such as physical or chemical deposition, patterning, lithography, and etching processes. By the very nature of these methods, most microcomponents essentially have a planar form over which are distributed surface geometrical features, whose primary geometric constraints comprise feature width, height, feature numbers, and feature spatial relationships; for example, the “surface” of a microfluidic component is composed of zones of different planar heights and geometrically dispersed channels. Although functional features of MEMS/MOEMS surfaces have the same scale of heights as general surface texture, the characterization of MEMS/MOEMS surfaces is different from general engineering surfaces. The field parameters are of little use for these MEMS/MOEMS features.
Prospects for Microsystems Packaging Technology
Published in Yufeng Jin, Zhiping Wang, Jing Chen, Introduction to Microsystem Packaging Technology, 2017
Yufeng Jin, Zhiping Wang, Jing Chen
MOEMS is a new type of technology comprised of micromechanical optical modulators, mi-cromechanical optical switches, IC, and other components. It is a new application of MEMS technology in optoelectronics. It realizes the seamless integration of optical devices and electrical devices by taking full advantage of the benefits of MEMS, such as small sizes, diversity, and microelectronics properties. In recent years, the application of optical MEMS devices in the communications industry has drawn much attention (particularly in the optical network and optical switch areas). Since optical MEMS devices heavily rely on high-precision optical, electrical, and mechanical designs, they have some special requirements for packaging. In addition to complete circuits for light and electricity, optical MEMS packaging must provide some other properties such as air tightness, mechanical strength, dimensional stability, and long-term reliability. In addition, the increase in I/O pin counts requires higher density of substrates and packages and different applications require different packaging. Packaging is a key process in the manufacturing of MOEMS, accounting for 75%−95% of the total cost.
Optical MEMS for space
Published in Guangya Zhou, Chengkuo Lee, Optical MEMS, Nanophotonics, and Their Applications, 2017
MOEMS devices have been developed or successfully used in a wide range of ground-based commercial applications, from telecom to life science, and from imaging to spectroscopy. MOEMS are not yet widely used for space applications, but this technology will most likely provide the key to new science and instrumentation in space. Several potential MOEMS devices for future space missions are described. The first major application will be the micro-shutters array in near infrared multi-object spectrograph (NIRSpec) for the James Webb Space Telescope (JWST).
Progress of optomechanical micro/nano sensors: a review
Published in International Journal of Optomechatronics, 2021
Xinmiao Liu, Weixin Liu, Zhihao Ren, Yiming Ma, Bowei Dong, Guangya Zhou, Chengkuo Lee
Starting from the late twentieth century, micro-electro-mechanical systems (MEMS) had become an enabling technology that provided many opportunities in the integration with micro-optics. Termed as micro-opto-electro-mechanical systems (MOEMS), this new class of microsystems mainly focus on the demonstration of the miniaturized optical components at its early stage.[1,2] During this period, the advances in telecommunication and fiber-optics technology enabled the development of many MOEMS components, including variable optical attenuators (VOA) for optical signal power levelling,[3–9] optical switches for optical matrix connection in data centers,[10–15] tuneable lasers for wavelength conversion,[16–19] etc. Moving forward, MOEMS technologies also find applications in many other thriving fields. For example, the MOEMS scanners are promising for miniaturized LiDAR and display applications;[20,21] the tuneable optical spectrometers show possibilities for the portable spectral analysis.[22] More recently, on-chip optomechanical systems have been widely explored for applications in quantum communication.[23,24] In parallel to demonstrating MOEMS components in the applications in the telecommunication field, many efforts have also been made to explore their sensing capability.