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Lithography, Etch, and Silicon Process Technology
Published in Bruce W. Smith, Kazuaki Suzuki, Microlithography, 2020
Matthew Colburn, Derren N. Dunn, Michael A. Guillorn
RIE has played a central role in patterning for semiconductors for over 30 years. For many years, the most commonly used plasma reactor produced a capacitively coupled plasma (CCP) discharge. In the CCP reactor, two electrodes are arranged parallel to each other like a simple capacitor. A modest vacuum is created in the reactor, and a partial pressure of process gas is introduced through a nozzle or through a shower head pattern in one of the electrodes. A DC or, more commonly, an AC plasma discharge is created between the electrodes containing reactive neutrals and a sheath region with an induced electric field through which ions accelerate toward the surface of one of the electrodes. By placing the substrate on this electrode, the directionality of the electric field can be used to enhance anisotropy. For a detailed treatment of plasma fundamentals, the reader is encouraged to refer to Lieberman and Lichtenberg’s textbook on plasma processing [102]. CCP etch systems have evolved significantly since their introduction, adding decoupled sources and one or more high-frequency excitations. This enhances control of the plasma generation and provides a means to modulate the electric field in the plasma sheath. Pulsed plasma technology has also been explored to enhance etch selectivity by achieving a finer degree of control of the ion energies and chemical species present in the plasma.
Adhesion behavior of different droplet on superhydrophobic surface of cotton fabric based on oxygen plasma etching
Published in The Journal of The Textile Institute, 2023
Wei Zhang, Jiming Yao, Xudong Liu, Ruosi Yan, Jianlin Xu
There are many ways to construct rough surface such as in-situ synthesis (Wang et al., 2013), chemical deposition (Jang et al., 2019), laser etching (Pan et al., 2019), graft polymerization (Liu et al., 2020), and spraying (Zhu et al., 2019) among others. However, not all methods are suitable for flexible substrates, because this involves durability performance. As a brand-new etching method, plasma treatment can be simply operated and shows stable performance. It is easy to obtain uniform microstructure by controlling the gas type, etching time, times of treatment, frequency, and gap. Therefore, it has become an important way to build microstructures (Huang et al., 2021; Anupriyanka et al., 2020). Although a uniform and rough surface can be obtained by etching the fabric with only plasma, the desired superhydrophobic and anti-adhesion effects cannot be achieved. Currently, researchers commonly use plasmas in combination with polymer coatings. According to a study conducted by Xu et al. (Xu et al., 2020) a two-roll padder was used to coat fluorine-free lauryl methacrylate on the surface of cotton fabric and then it was crosslinked with RF capacitively coupled plasma to prepare a superhydrophobic fabric with excellent wearing comfort. Elsewhere, Zhou et al. (Feng et al., 2020) reported that after pretreatment with low-temperature plasma, the profiled polyethylene terephthalate fabrics exhibited higher water contact angle, abrasion resistance, laundering durability, and chemical stability as compared with fabrics having normal circular cross-section.
Dynamics of dust-ion acoustic cnoidal and solitary pulses in a magnetized collisional complex plasma
Published in Waves in Random and Complex Media, 2021
Asmaa Mohamed Abdelghany, Mohammed Shihab, Mahmoud Saad Afify
Radio-frequency capacitively coupled plasma reactors (RF-CCPs) are characterized with a simple configuration to generate low temperature plasma for various plasma processing applications as plasma etching, deposition, and sputtering [1, 2]. High rates of the plasma processing is achieved via increasing the plasma density over the substrates. This could be done using an external magnetic field as in RF magnetron [3, 4]. The magnetic field traps the plasma electrons allowing an increase of the ionization rate, and, consequently, an increase of the plasma bulk over the substrates. Accelerated ions in the plasma sheath may hit the target and produce dust particles. Also, dust particles may be added artificially to the discharge. The confinement of dust particles in plasma sheaths has been found to excite low-frequency acoustics modes. The dust acoustic waves have been found to propagate along the direction of streaming ions and gravity and to be a function of the applied magnetic field [5]. It is really interesting and mandatory for plasma processing to investigate the excitation of dust acoustic waves in this complex plasma and to compare our theoretical results with available experimental results.