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Fundamentals of Microfabrication Technologies
Published in Ghenadii Korotcenkov, Handbook of Humidity Measurement, 2020
It is important to note that indicated standard processing steps originating from semiconductor technology can be used for fabrication of solid-state humidity sensors discussed in Volume 2 (Dennis et al. 2015). Humidity sensors of this type are fabricated using standard CMOS process with some form of post-CMOS micromachining or other additional post-CMOS processes to complete the sensor design. A hybrid CMOS process is also can be used to deposit, pattern, and activate the humidity-sensing element. Thick-film technology uses screen-printing techniques to apply and pattern conducting pastes or inks onto ceramic substrates to form interconnects and passive components such as resistors (Prudenziati and Morten 1986). Typical film thickness is usually greater than 5 μm. Table 15.1 summarizes the key features of each technology (Prudenziati and Morten 1986; Prudenziati 1994; Fenner and Zdankiewicz 2001). One should note that material purity and process cleanliness during CMOS-based sensor fabrication are critical. Therefore, semiconductor-class tooling is required for CMOS process realization because contaminants will adversely affect the mechanical and electrical properties of the sensing structures, resulting in parts that fail to meet product specifications.
Overview of Ceramic Interconnect Technolgy
Published in Fred D. Barlow, Aicha Elshabini, Ceramic Interconnect Technology Handbook, 2018
Aicha Elshabini, Gangqiang Wang, Dan Amey
Ceramic substrates provide the base onto which all thick-film circuits are fabricated. Ceramic materials are used in substrate applications primarily because of their high mechanical strength, high electrical resistivity over a broad temperature range, and chemical inertness relative to a variety of processing conditions. Because ceramic substrates can withstand temperatures in excess of 1000°C, thick-film materials are often fired at temperatures of about 1000°C and lower. Thick-film technology comprises specially formulated pastes applied using screen printing, fired onto a ceramic substrate in a definite pattern, and sequenced to produce electrical components, interconnections, and a complete functional circuit. These pastes possess an organic binder to make them thixotropic in nature with dual viscosity: viscous at rest and flowing with motion [22]. These pastes possess essentially a functional phase to produce a film with desired electrical properties. Depositing successive layers result in multilayer interconnection formation containing integrated passive components, added active chips, and integrated circuits (see Figure 1.2).
Optoelectronic Receivers
Published in Clemens Baack, Optical Wideband Transmission Systems, 2018
Wolfgang Albrecht, Clemens Baack
A further possibility for setting up a main amplifier consists in connecting of three series feedback stages. The basic circuit for this amplifier is shown in Figure 47. With a current gain of 17 dB and a 3-dB bandwidth of 2 GHz (Figure 45), neither the gain nor the bandwidth of the first circuit can be achieved. The advantage of this circuit concept is that it can be very easily implemented using thick film technology.
Device profile of the MED-EL cochlear implant system for hearing loss: overview of its safety and efficacy
Published in Expert Review of Medical Devices, 2020
Uwe Baumann, Timo Stöver, Tobias Weißgerber
Regarding the C40+ device, the manufacturer made a change in the production of the stimulator housing in 2003. Micro-leaks at the soldering point of the housing were frequently identified as the reason for the observation of moisture in devices that were analyzed after failure and explantation. Thick-film technology was replaced by thin-film laser soldering, which led to improved CSRs of the C40+ device after implementation.