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Overview of Ceramic Interconnect Technolgy
Published in Fred D. Barlow, Aicha Elshabini, Ceramic Interconnect Technology Handbook, 2018
Aicha Elshabini, Gangqiang Wang, Dan Amey
From its introduction in the early 1980s, LTCC was primarily used in military and medical applications. The advent and explosion of wireless technology in the mid-1990s brought LTCC into the forefront for many commercial wireless products such as cellular phones and wireless local area network (WLAN). The adoption of LTCC was a result of excellent high-frequency performance in terms of dielectric loss (up to 70 GHz) and property stability over a broad frequency range and environmental conditions (–40 to 70°C), coupled with the capability of embedded passives offering very high packaging density. Fine-line patterning and thermal performance was also important for the high-density packaging and miniaturization needed for personal and mobile communications products. The production volumes of modules such as the Bluetooth™ circuits were such that costs were equal or better than organic equivalents.
Nanosensor Laboratory
Published in Vinod Kumar Khanna, Nanosensors, 2021
Reliable operation of nanosensors in harsh environments, such as elevated temperatures, high pressure, and aggressive chemical media, poses stringent requirements on packaging, which cannot be met using polymer-based technologies. Ceramic technologies, especially low-temperature co-fired ceramics (LTCC), an evolution of thick-film technology, where the multilayer substrate is co-fired with the other layers (resistors, conductors, etc.), offer a trustworthy platform on which to build stable and reliable packages. LTCC allows fabrication of complicated 3D structures, with fluidic channels for liquids and/or gases, while simultaneously permitting 3D electrical circuits in the same device.
Compact LTCC millimeter wave bandpass filter with imbedded dielectric resonators
Published in Electromagnetics, 2022
Xueyuan Guan, Xiangjun Zhang, Qianqi Bian, Yushun Liu
The DR is designed as a separate component and applied to the filter according to the performance requirements, and its shape is relatively three-dimensional, which is often not suitable for the structure of low profile. In the study by Gong and Hu (2014), a concept of substrate-integrated dielectric resonator (SIDR) is proposed and successfully applied to low-profile antennas. In the study by Sheng Tang et al. (2021), a low-profile millimeter wave bandpass filter (BPF) was successfully realized by using SIDR, which verified the feasibility of SIDR technology in microwave filter design. There are several technologies exploited to design the filter and other microwave components, such as PCB and liquid crystal polymer technologies. Compared these technologies, low-temperature ceramic co-fired (LTCC) technology has advantage of integrating the components in three dimensions, which make the components have more compact size.
Sintering characteristic, structure, microwave dielectric properties, and compatibility with Ag of novel 3MgO-B2O3-xwt% BaCu(B2O5)-ywt% H3BO3 ceramics
Published in Journal of Asian Ceramic Societies, 2022
Haiquan Wang, Shixuan Li, Kangguo Wang, Xi Wang, Hailin Zhang, You Wu, Xiuli Chen, Huanfu Zhou
To investigate whether the 3MgO-B2O3-6 wt%BCB-15 wt%H3BO3 and 3MgO-B2O3-8 wt%BCB-5wt%H3BO3 ceramics could reacted with silver electrodes or not, the two calcined powders were mixed with 20 wt% Ag powder and sintered at 950°C and 925°C for 4 hours, respectively. Figure 8 shows the XRD patterns and backscattered electron diagrams of the samples. The XRD shows that Ag was presented as a single phase and the EDS displays that the bright particles in the main ceramic matrix were silver, which further confirms that there is no reaction between the silver and 3MgO-B2O3-8 wt%BCB-5 wt%H3BO3 and 3MgO-B2O3-6 wt%BCB-15 wt%H3BO3. All these results prove the potential application of both ceramics in LTCC technology.
Design, Analysis and Validation of MCP Package for GaAs Monolithic Microwave Integrated Circuits Packaging
Published in IETE Journal of Research, 2022
Ravi Gugulothu, Sangam Bhalke, Lalkishore K, Ramakrishna Dasari
The design of multistage amplifiers usually consists of the optimization of high gain, overall low noise figure and overall high power. For this, all-interconnecting stages should be properly designed and optimized to match a 50ohm resistance. Multichip module (MCM) configuration is shown in Figure 16. A 20 dB gain identical MMIC was selected in two stages to meet the more than 35 dB gain. An internal 3 dB thermo-pad is used for better interstage matching and gain compensation to 35 dB application with no drift over an environmental test condition. This MCM package should meet the hermiticity requirement. The package is hermetically sealed by using the resistive welding technique in an inert environment as per the specification space standards. Presently various multichip module techniques are available in a 3D packaging manner. LTCC is an advanced 3D packaging technique used in the industry for microwave and millimetre wave integrated circuits packaging. This technique has the non-compliance issues of meeting the leak rate specifications when used for multichip packaging in a single cavity. Hence, proposed a package with a Kovar seal ring suitable for resistive welding meeting the fine leak as well as gross leak specifications as per mil-std-883 and accommodating 35 dB gain.