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III-Nitride Flexible Electronic Devices
Published in Chinmay K. Maiti, Fabless Semiconductor Manufacturing, 2023
The introduction of flexible electronics requires the exploitation of new materials and new manufacturing and integration techniques. To bring conformability to the electronic components, two techniques are considered: (i) the first is to manufacture the components on a rigid substrate and to transfer to a flexible substrate layer, and (ii) the second is to make the components directly on the flexible substrate. This technique is used mainly in the context of silicon technologies and III-V materials [27]. The advantage is to provide high-performance devices with flexible supports. As for the disadvantages, they reside in the fragility of epitaxies to transfer, risks of mechanical degradation of the components, small surface transferred, and high cost of the process.
Flexible Sensors for Biomedical Applications Based on Elastic Polymers
Published in Sam Zhang, Materials for Devices, 2023
Hui Li, Jing Chen, Lin Li, Lei Wang
With the rapid development of modern society, new and disruptive technologies such as the artificial intelligence, wearable medical devices, and Internet of Things have emerged in recent years, improving the well-being and quality of life. Flexible electronics plays an important role in the aforementioned applications in the form of healthcare monitoring, bio-integrated devices, electronic skin, human–machine interface, etc. Compared with conventional microelectronic devices fabricated on rigid silicon substrates, flexible electronics not only show comparable performance but also have some unique features beyond rigid devices, such as ultrathin thickness, outstanding flexibility. This unique advantage has attracted tremendous research interests on flexible electronics, and various applications have been developed, such as stretchable transistors, light-emitting diodes, energy harvesters, energy storage devices, and flexible sensors.
Fabrication of Transparent Antennas on Flexible Glass
Published in Katsuyuki Sakuma, Krzysztof Iniewski, Flexible, Wearable, and Stretchable Electronics, 2020
Jack P. Lombardi, Darshana L. Weerawarne, Robert E. Malay, Mark D. Poliks, James H. Schaffner, Hyok Jae Song, Ming-Huang Huang, Scott C. Pollard, Timothy Talty
Flexible electronics is an emerging technology that holds promise to revolutionize functionality of electronics and how they are manufactured. With a projected growth from $29 billion in 2017 to $73 billion in 2027, the flexible electronics industry shows potential for huge growth with efficient, low-cost, and environmentally friendly applications in automobile [1, 2], aerospace [3], healthcare [4], and many more. The flexibility and conformability of the substrates used in flexible electronics and roll-to-roll (R2R) manufacturing provide unique capabilities for manufacturers to fit and conform devices into confined spaces [5, 6]. Flexible substrates are often based on polymers such as polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyimide (PI), but thin flexible glass substrates play a critical role. While maintaining the high transparency and flexibility that polymer substrates provide, flexible glass presents an ultra-smooth, high-temperature, and high-vacuum processable surface, which makes it attractive in conventional micro-/nano-fabrication. Corning® Willow® Glass is one such flexible glass substrate that provides lower coefficient of thermal expansion (CTE) and better surface quality [7–9] (see Table 12.1) and is extensively used in this report for fabrication of transparent antennas. The flexibility of these glass substrates also makes them compatible with high-throughput R2R manufacturing, which further lowers the cost and allows for large area fabrication, an advantage for photovoltaics [10–12].
Graphene in wearable textile sensor devices for healthcare
Published in Textile Progress, 2022
Md Raju Ahmed, Samantha Newby, Wajira Mirihanage, Prasad Potluri, Anura Fernando
Wearable technology is the melding between digital technology and textiles (Tyler et al., 2019). Advances in the development of flexible electronics, advanced materials, and electrical sensing technology have resulted in crucial changes to the current wearable medical devices and systems that make this possible (Chun et al., 2019; Nightingale et al., 2019; S. J. Park & Park, 2019; L. Wang et al., 2012; Yan et al., 2019; C. Yang et al., 2019; Zhao et al., 2019). These devices offer unique and advantageous features such as comfort, flexibility, fast action, and remote monitoring (Amjadi et al., 2016; Y. Khan et al., 2016). While wearable healthcare systems are currently used in the medical industry for real-time, non-invasive monitoring and analysis of human physiological health parameters; including blood pressure, respiration, metabolites, and wound healing, there is an urgency to integrate additional functions into the devices as technology advances (Manjakkal et al., 2020; Pang, Jian, et al., 2018; N. Wang, Xia, et al., 2019).
Direct printing of performance tunable strain sensor via nanoparticle laser patterning process
Published in Virtual and Physical Prototyping, 2020
Ji-Hyeon Song, Ho-Jin Kim, Min-Soo Kim, Soo-Hong Min, Yan Wang, Sung-Hoon Ahn
Flexible electronics have conformable shapes and can be bent and rolled. They are attractive for next-generation industrial and medical products, being not only flexible but also lightweight and portable. Example applications include electronic paper, rollable displays, flexible mobile devices, and implantable sensors. Despite the great potential, the fabrication of flexible electronics still remains confined to a laboratory as the fabrication processes are complex and expensive. In addition, the circuits are usually printed on flexible substrates such as plastic, fabric and paper, which are delicate and heat-sensitive. Traditional photolithography, which uses high temperatures and corrosive chemicals, easily causes damages in flexible substrates. Fabrication of flexible electronics poses new manufacturing challenges.
Design and validation of a gripper for the automated assembly of film components in flexible electronics manufacturing
Published in International Journal of Computer Integrated Manufacturing, 2023
Marcello Valori, Vito Basile, Gianmauro Fontana, Jose A. Mulet Alberola, Serena Ruggeri, Simone Pio Negri, Irene Fassi
Flexible electronics is a well-established technology, nowadays implemented in a wide variety of products as a fundamental booster of miniaturization, compactness and reliability. However, there is still room for improvement in the fabrication process of FPCB. The presented paper deals with the automation of the assembly of film-based coverlays, and in particular with the development of a suitable gripper for a fully automated process.