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Fiber Optic Sensors
Published in Robert G. Hunsperger, Photonic Devices and Systems, 2017
Electroless deposition has an advantage over electrodeposition in that a thin conducting layer is not necessary beforehand. This process requires a suitable metal-bearing salt, a reducing agent, and an appropriate catalyst. It has been used successfully in the deposition of cobalt for metallic film disks. Problems with alloy compositions are similar if not more severe than with electrodeposition.
Nanostructured Silicon as Host Material
Published in Klaus D. Sattler, st Century Nanoscience – A Handbook, 2020
Electroless deposition is a plating method without the application of electricity. In this case the electrons are supplied by the reducing agent of the solution. The reaction is described as follows by reduction and oxidation [40]: Msolz++Redsol→catalytic surfaceMlat+Oxsol
A critical review of copper electroless deposition on glass substrates for microsystems packaging applications
Published in Surface Engineering, 2022
Unlike the electroplating process, the electroless deposition process is cost-effective and suitable for mass production as it is initiated without an electric current. The process involves an autocatalytic redox reaction that reduces metal ions into the metal on the substrate [63]. An electroless deposition bath consists of metal ion sources, reducing agents, complexing agents, and additives. Reducing agents are the solution's driving force for reducing metal ions [64–74]. Electroless deposition is initiated once catalyst particles are available on the substrate surface [67]. Catalysts form a momentary electron bridge across the metallic ions and reducing agents [68]. Therefore, the availability of catalysts on the substrate surface is required for electroless deposition.
Electroless copper plating of dielectrics from environmentally friendly reducer-free electrolyte
Published in Transactions of the IMF, 2021
M. Georgieva, Ch. Girginov, M. Petrova, D. Lazarova, E. Dobreva, S. Kozhukharov
Various metal coatings (copper, silver, nickel, chromium, etc.) can be deposited on organic dielectric materials (polysulfone, teflon, polypropylene, acrylonitrile–butadiene-styrene (ABS), polyethylene, etc.).5,6 Different methods can be used for this purpose: thermal spray deposition, magnetron sputtering and electroless deposition.7 It is worth noting that the electroless deposition method has a number of advantages related to the simplicity of the equipment used, reliable process control, purity of the formed coatings, etc. As a consequence, this method is being increasingly employed in the metallisation of various components, made of plastics.8,9