China
Africa
Explore chapters and articles related to this topic
Drastic Improvement of Dielectric Performances by Nanocomposite Technology
Published in Toshikatsu Tanaka, Takahiro Imai, Advanced Nanodielectrics, 2017
Muneaki Kurimoto, Kazuyuki Tohyama, Yasuhiro Tanaka, Yoshinobu Mizutani, Toshikatsu Tanaka, Masayuki Nagao, Naoki Hayakawa, Takanori Kondo, Tsukasa Ohta
Electrochemical migration (below shortened to migration) is an insulation deterioration phenomenon for reaching a short circuit by the dissolution as ions and a precipitated product from electrode metals. Recently, since the downsizing and the densification of various electronic parts have advanced, insulation deterioration caused by migration has become more critical. The latest evaluation method verified that nanofiller controls migration.
Electrical Equipment in a Corrosive Environment
Published in Bella H. Chudnovsky, Transmission, Distribution, and Renewable Energy Generation Power Equipment, 2017
The degree of corrosion may be to the extent that electrical failures can occur. Creep corrosion is not to be confused with electrochemical migration found with thick electrolytic plated silver. Electrochemical migration failure mechanism is characterized by long dendrites that grow in one direction, typically from one electrical source to another until a bridge is formed and a short occurs.
Localised aqueous corrosion of electroless nickel immersion gold-coated copper
Published in Corrosion Engineering, Science and Technology, 2022
M. Mousavi, A. Kosari, J. M. C. Mol, Y. Gonzalez-Garcia
In an era of highly sophisticated electronic and communication technology, electronic devices have extended to all aspects of our daily life. As a non-volatile data storage device, Secure Digital (SD) memory cards upgrade the storage capacity of electronic devices such as smartphones, digital cameras, tablets, etc. The central part of every SD memory card consists of a printed circuit board (PCB) that includes metallic pins [1,2]. Considering the electronic application of every single PCB in an integrated system, a specific number of circuits are mounted on a plastic backbone. Electronic PCB components such as resistors, capacitors and inductors are connected through Cu traces that conduct electrical currents. However, as they are used in many potentially corrosive service environments, the oxidation of non-embedded Cu without protective coating is highly probable [3–5]. Moreover, the functional integrity of electronics is not only affected by the corrosion of Cu in itself, but also by electrochemical migration and redeposition of dissolved Cu ions on a neighbouring Cu electrode, due to oxidation of Cu and the presence of an electric field potentially jeopardising the reliability of electronics in service [6–9].