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Optical Interconnect
Published in Kenichi Iga, Yasuo Kokubun, Encyclopedic Handbook of Integrated Optics, 2018
The idea of optical interconnect is to optical technology to transmit or connect devices, components, and subsystems instead of metal wiring. The advantage of optical interconnect includes its high speed capability basically with no limit, light weight, and low power consumption. Another important issue is parallel lightwave systems including numerous optical fibers. By taking this advantage, the optical interconnect is considered to be inevitable also in the computer technology. Some parallel interconnect schemes and new concepts are being researched. Vertical optical interconnect of LSI (Large Scale Integration) chips and circuit boards may be another interesting issue. The two-dimensional arrayed configuration of surface emitting lasers and planar optics will give way to a new era of opto-electronics.
Silicon-on-Chip Lasers for Chip-level Optical Interconnects
Published in Choi Jung Han, Iniewski Krzysztof, High-Speed and Lower Power Technologies, 2018
As the strategy for improving computing power moves from increasing the performance of a single computing unit to increasing the number of computing units, the efficiency and performance of communications between computing units becomes a key factor in determining the performance of an entire computer system. For communications with a distance over meters, optical interconnects have fundamental advantages over electrical interconnects. Thus, data communications in data centers and clustered high-performance computer systems are already based on optical interconnects. In recent several years, there have been increasing discussions and studies on using optical interconnects even for chip-level communications with a much shorter interconnect distance of, e.g., a few centimeters [1–5].
Paradigm Shift of On-Chip Interconnects from Electrical to Optical
Published in Thomas Noulis, Noise Coupling in System-on-Chip, 2018
Swati Joshi, Amit Kumar, Brajesh Kumar Kaushik
Optical interconnects are considered as top candidates to replace electrical interconnect for on-chip applications. Long distance communication is already dominated by optical fibers working in the wavelength band around 1550 nm with the optical loss of about 0.22 dB/km and enormous bandwidth [41]. Optical interconnects use light as a means of communication. The development in this direction requires significant efforts to develop components for on-chip optical communication including light sources, waveguides, couplers, passive devices, modulators, and detectors. An on-chip optical interconnect link is illustrated in Figure 14.14. It consists of a laser source, modulator, waveguide, and photodetector along with signal processing circuitry.
Dynamic O-band to C-band wideband wavelength converter for integrated VCSEL-based optical interconnects
Published in Journal of Modern Optics, 2019
G. M. Isoe, D. K. Boiyo, T. B. Gibbon
Broadband wavelength converter technologies are key fundamental functionality for high-speed data traffic routing to maximize network robustness in optical interconnects. This work has shown a VCSEL-based wavelength converter technique as an enabling approach for adoption in complex optical interconnects with multiple network nodes supporting devices operating at different transmission bands. Since the converted wavelengths attained error free transmission with clearly open eye after re-modulation, our proposed technique proves a key concept for adoption in complex optical interconnect links involving high-speed data signals and real-time wavelength routing. Other than supporting the high-speed requirements (8.5 Gbps), our proposed O-band to C-band real-time wavelength converter based on VCSEL technology comply with strict power requirement, cost and size limitations, thus allowing for integration with densely packed optical interconnects. The high-speed inter-band wavelength switching technology concept has been demonstrated using data rates of 8.5 Gbps due to availability of necessary equipment in our laboratory. However, higher data rates can still be supported in the same network system where splitting ratio, reach and aggregated capacity can be traded off against one another to maximize system performance.
Research of the bending loss of S-shaped waveguides with offsets and trenches
Published in Journal of Modern Optics, 2021
Yuling Shang, Wenjie Guo, Jiaqi Wang, Chunquan Li, Yamin Zhao
The inherent limitations of traditional copper-based electrical interconnection, such as electromagnetic interference, bandwidth scalability, power consumption, and system density, can be overcome by optical interconnects [1]. In optical circuits, to link optical components or devices, L-bend [2], V-bend [3], U-bend [4], and S-bend waveguides [5,6] are used. The S-shaped waveguides, intended to connect devices placed on different locations, have attracted many researchers. However, the S-shaped waveguides undergoing tight bends can cause a large bending loss in compact optical circuits [7]. Therefore, reducing the bending loss of S-shaped waveguides is extremely important.