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Micro-Manufacturing Processes for Gas Sensors
Published in Ankur Gupta, Mahesh Kumar, Rajeev Kumar Singh, Shantanu Bhattacharya, Gas Sensors, 2023
Pankaj Singh Chauhan, Shantanu Bhattacharya, Aditya Choudhary, Kanika Saxena
The most commonly used substrate material for IC fabrication is silicon (Si). The advantage of using Si as substrate material is the integration with transducer and circuitry (e.g. CMOS) [1]. Si is produced and supplied in the form of single crystal wafers. It becomes a default substrate for fabricating miniaturized devices. The micromachining of Si substrates has also been explored by the researchers to develop mechanical structures [27]. Glass, due to its unique dielectric and optical properties, has also been utilized as substrate material by many developers. The glass can also be structured by using dry and wet etching techniques. Glass is suitable for sensors which utilize optical detection principle due to its transparent property for visible light [28]. Glasses are also chemically inert and can be used at high operating temperature. Ceramic materials are also used as substrates due to their insulating property. Ceramics are chemically inert, mechanically stable, and biocompatible. Most of the microelectronic devices are packaged using ceramic materials. Alumina (Al2O3) is commonly used ceramic material [29]. Nowadays polymeric materials are widely used as substrates for fabricating micro-electronic devices and sensors. Flexible electronics technology is based on conducting polymers and flexible polymeric substrates [30]. Polymers are low-cost and disposable materials and hence they are suitable for bio-sensing application.
Nano- and Microsystems: Classification and Consideration
Published in Sergey Edward Lyshevski, Nano- and Micro-Electromechanical Systems, 2018
The motion mechanical microstructures can be protected (sensor applications such as accelerometers, gyroscopes, etc.) and unprotected (interactive environment actuator and sensors). Therefore, MEMS can be packaged, encased, and encapsulated in a clean, hermetically sealed package. However, some elements can be unprotected to allow the direct interaction and active interfacing with the environment. This creates challenges in packaging. It is important to develop novel electromechanical motion microstructures and microdevices (sticky multilayers, thin films, magnetoelectronic, electrostatic, quantum-effect-based devices, etc.) and examine their properties. Microfabrication of very large-scale integrated circuits (VLSI), microscale structures and devices, and optoelectronics must be addressed for MEMS. Fabrication processes include lithography, film growth, diffusion, implantation, deposition, etching, metallization, planarization, packaging, etc. Complete microfabrication processes with integrated sequential processes are of great importance. These issues are covered in this book.
New Trends in Engineering and Science: Micro- and Nanoscale Systems
Published in Sergey Edward Lyshevski, Mems and Nems, 2018
The motion mechanical microstructures can be protected (sensor applications, e.g., accelerometers and gyroscopes) and unprotected (actuator and interactive environment sensor applications). Therefore, MEMS can be packaged (encased) in a clean, hermetically sealed package, or some elements can be unprotected to allow interaction and active interfacing with the environment. This creates challenges in packaging. It is extremely important to develop novel electromechanical motion microstructures and microdevices (sticky multilayers, thin films, magnetoelectronic, electrostatic, quantum-effect-based devices, etc.) and sense their properties. Thus, microfabrication of very large scale integrated circuits (VLSI), microscale structures and devices, as well as optoelectronics must be addressed. Fabrication processes include lithography, film growth, diffusion, implantation, deposition, etching, metallization, planarization, etc. Complete microfabrication processes with integrated sequential processes are of great importance. These issues are covered in Chapters 3 and 8.
A Single Phase GaN GITs-Based Bidirectional Multilevel Inverter for High Voltage Grid Tied Photovoltaic Power System
Published in Electric Power Components and Systems, 2023
Muhammad Mohsin Naveed, Alberto Castellazzi
Besides robust and reliable control of the power flow of grids, the power density, efficiency, reliability, and cost of the grid tied power converters energized by PV panels, are challenging tasks [10, 11]. One of the major components of power converters, contributing to these factors in solar power system is the power device technology. Two of the most frequently used power device technologies are the MOSFETs and the IGBTs. The selection of these semiconductor devices for power converter applications are made on: (a) switching frequency requirements, (b) power levels, and (c) cost. For the fabrication of these devices, the widely used semiconductor materials are Silicon (Si) and Silicon Carbide (SiC). A careful selection of semiconductor material can effectively increase the performance and efficiency of solar power system.
Graphene-based composites for biomedical applications
Published in Green Chemistry Letters and Reviews, 2022
Selsabil Rokia Laraba, Wei Luo, Amine Rezzoug, Qurat ul ain Zahra, Shihao Zhang, Bozhen Wu, Wen Chen, Lan Xiao, Yuhao Yang, Jie Wei, Yulin Li
Beside these techniques, other emerging methods could be highlighted, such as additive manufacturing fabrication, in which graphene-based polymeric nanocomposites are 3D printing. 3D geometry of the final part or device is built by successive layers deposed horizontally (2D) by a 3D printer (42). The layer-by-layer approach (LBL) also is an emerging technique to prepare multilayers of GBC (thin films). It consists of alternating polymer-graphene or all graphene layers. The LBL has been widely used for self-assembly operations (43, 44). Assembly consists of using electrostatic interactions for deposing alternating layer of opposite charge of graphene and polymer (45, 46). The resultant composite material is to manufacture well-matched parts (47). For instance, Vlassiouk et al. (48) were able to prepare an ideal composite architecture (a film of CVD graphene-PMMA). The graphene layers were perfectly oriented without rolling or crumpling. In another study, Lee et al. have developed a thin film supercapacitor made of multilayers GBC (GO-polyaniline) LBL assembly. The resulting film was controlled in terms of thickness, electronic conductivity, flexibility, and chemical stability (44).
Designing ultra-personalized product service systems
Published in CoDesign, 2020
Troy Nachtigall, Svetlana Mironcika, Oscar Tomico, Loe Feijs
The game takes into account another challenge in co-design which is standardising material behaviour (SB). When using data like a material, the behaviour of the material needs to be understood. We see these opportunities already being addressed in the form of research products (Odom et al. 2016) where specific requirements (inquiry-driven, finish, fit, and independent) allow the product to be deployed for long periods over product lifetimes. Additionally, other challenges include creating consistent and uniform results when digital fabrication technologies have a different precision than industrial manufacturing. Real-time feedback and feedforward data can already be seen in concrete 3D Printing (Wolfs et al. 2018) which illuminates new opportunities for UPPSS digital fabrication.