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Current and Heat Transfer across the Contact Interface
Published in Milenko Braunovic, Valery V. Konchits, Nikolai K. Myshkin, Electrical Contacts, 2017
Milenko Braunovic, Valery V. Konchits, Nikolai K. Myshkin
Electrically conductive coatings produced by electroplating reduce the contact resistance caused by, among other factors, decrease in hardness, higher conductivity of plating compared to substrate, prevention of insulating film formation, corrosion, and reduction in mechanical wear. Gold plating is often used in case of copper-based connecting members, but even gold-plated contacts can be affected by environmental action if the plating is thin and porous.376,377
Development of an upper-limb neuroprosthesis to voluntarily control elbow and hand
Published in Advanced Robotics, 2018
Yosuke Ogiri, Yusuke Yamanoi, Wataru Nishino, Ryu Kato, Takehiko Takagi, Hiroshi Yokoi
In order to achieve control by s-EMG extracted from the innervated muscles, myoelectric sensors of dry electrodes are placed at four locations, as shown in Figure 6. These four sensors are in contact with the long head of the biceps brachii muscle, short head of the biceps brachii muscle, long head of the triceps brachii muscle, and lateral head of the triceps brachii muscle. The surface of the sensors consists of silicone rubber and a gold plated wire. The s-EMG is measured using the silicone rubber. It is, however, measured using the gold-plated wire in the case of a large skin impedance, such as in the case of sweating. These sensors are used by sewing them on a band made of cloth.
Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
Published in The Journal of Adhesion, 2022
Naoaki Tsurumi, Yuta Tsuji, Taiki Baba, Hiroyuki Murata, Noriyuki Masago, Kazunari Yoshizawa
The materials used in this experiment are listed below. The body of the test specimen had the same configuration as the substrate for the LED assembly. The base of the substrate was a glass/epoxy prepreg, on which a copper foil was laminated. The surface of the copper foil was electroplated with nickel and gold. The thicknesses of the nickel and gold plated layers were 15 and 0.24 μm, respectively. The total thickness of the substrate was 0.44 mm.