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Basics of Metal Matrix Composites and Their Application in Transistor Electronics
Published in Suneev Anil Bansal, Virat Khanna, Pallav Gupta, Metal Matrix Composites, 2023
Anand Sharma, Triloki, Sanjeet Kumar, Vishwas Acharya
Intermetallic compounds are formed when two dissimilar metals are combined in accordance with the rules of their chemical valence. Generally, intermetallic bonding is not metallic, ionic, or covalent in nature, however. Such an alloy is referred to as an intermetallic compound (intermetallics usually have a stoichiometric composition and show up as a line compound in the phase diagram. Utilized as a matrix material for making composites, they can possibly enhance the operating temperatures over ordinary materials. Intermetallics may have a structure that is disordered or ordered. Ordered for intermetallic alloys have structures with long-range ordering characteristics, That is to say, unique positions in the lattice are filled by various atoms. Because of their ordered structure, Dislocations in intermetallics are much more constrained in the ordered structure than in disordered alloys. This leads to retention (and, in some examples, even increase in intensity at elevated temperatures is a very attractive feature). The nickel aluminide, for example, displays a marked rise in strength up to 800°C. The extremely low quality of intermetallics is an undesirable function. Ductility of the ambient temperature. Molybdenum disilicate (MoSi2) is an essential disordered intermetallic element. It has a high melting point and exhibits good temperature stability. In an oxidizing atmosphere, over 1200°C. It is also used as a heating system furnace feature. The strong tolerance to oxidation comes from a safeguard SiO2 picture, which is produced at high temperatures (Steurer& Dshemuchadse, 2016).
Printed Energetics
Published in Mark J. Mezger, Kay J. Tindle, Michelle Pantoya, Lori J. Groven, Dilhan M. Kalyon, Energetic Materials, 2017
Lori J. Groven, Mark J. Mezger
Pen-type printing is the most amenable to a wide range of viscosities and ultimately will likely be the best method for manufacturing needs because of its speed and resolution. Pen-type printing can take many forms from simple deposition to 3D architectures. There are multiple heads that can serve in this role from a wide range of vendors (e.g., auger valves, piezo valves, positive displacement systems, and so on). Several researchers have investigated pen-type deposition but the earliest work on intermetallic inks was reported in 2004–2005 at Sandia National Laboratory—Albuquerque by Alex Tappan. In that effort, micron-sized powders were used to formulate a stoichiometric mix of aluminum and nickel powder to form upon combustion the intermetallic nickel aluminide, NiAl. Multiple structures were fabricated but the final design consisted of a tennis racquet lattice with multiple passes as shown in Figure 7.4. The combustion characteristics were subsequently studied as shown in Figure 7.4b.
Influence of various factors on low-stability pre-transitional structural-phase states of NiAl intermetallic compound
Published in A. I. Potekaev, A. M. Glezer, V. V. Kulagina, M. D. Starostenkov, A. A. Klopotov, Structure and Properties of Intermetallics in Pre-Transitional Low-Stability States, 2020
A. I. Potekaev, A. M. Glezer, V. V. Kulagina, M. D. Starostenkov, A. A. Klopotov
A characteristic representative of such materials is the NiAl intermetallic compound of the Ni–Al system. Nickel aluminide is being actively studied as a promising material for the aerospace industries. Useful characteristics of NiAl are its high melting point, relatively low density, good chemical resistance, high thermal conductivity, high strength, and metal-like properties. A characteristic feature of the Ni–Al alloys system is a high ordering energy. The NiAl intermetallic compound and its substitutional solid solutions have a high degree of long-range order, which is maintained in the entire temperature-concentration region of their existence up to the melting point.
Development of reflective co-sputtered nanostructured metallic films
Published in Surface Engineering, 2021
K. Prajwal, G. L. Priyanka, Mohammed Adnan Hasan, A. Carmel Mary Esther, N. Sridhara, A. Rajendra, S. B. Arya, Arjun Dey
Additionally, it is important to note that the XRD data (Figure 3) depicts the formation of intermetallic compounds, nickel aluminide in co-sputtered Al + Ni film while Ag + Ni showed individual phases of Ag and Ni as expected. The significant inferior reflectivity of Al + Ni film as compared to Ag + Ni film is possibly also link with the formation of intermetallic compounds.