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Achieving Scalability in the 5G-Enabled Internet of Things
Published in Yulei Wu, Haojun Huang, Cheng-Xiang Wang, Yi Pan, 5G-Enabled Internet of Things, 2019
Fuchun Joseph Lin, David de la Bastida
where TDP is the microprocessor’s Thermal Design Power, a reference measurement of CPU running in normal conditions and given by the manufacturer. For our particular testbed, TDP is 80 W. In addition, K is the common power consumption of memory modules, typically 3 W for DDR3 memory cards. CPU% and Memory% are the average CPU and memory measurements, respectively, on each host system. Figure 5.21 shows that there is 16.5%, 9%, 12.5% and 12.7% less power consumption for smart meter, eHealth, Bluetooth tags and video, respectively. This is due to the fact that the system is able to handle a larger number of requests during the same period of time with network slicing enabled, thus a lower power consumption per request can be achieved.
Edge AI
Published in Pethuru Raj, Anupama C. Raman, Harihara Subramanian, Cognitive Internet of Things, 2022
Pethuru Raj, Anupama C. Raman, Harihara Subramanian
Power consumption is a critical factor for edge devices. Low-end edge devices are mainly battery-powered, and this is a definite challenge. Thus, power preservation methods are sincerely sought for edge computing to survive and thrive. Therefore, for industry IoT solutions, the thermal design power (TDP) of the chip is a critical factor. With less power consumption, the amount of heat getting dissipated to the environment, fragile, is also less. Chip manufacturers are therefore investing their time, treasure, and talent on engineering power-efficient chips towards embedding in edge devices.
Experimental investigation of rectangular mini channel array as an effective tool for energy efficient cooling of electronic gadgets
Published in Energy Sources, Part A: Recovery, Utilization, and Environmental Effects, 2023
Jitendra D Patil, B S Gawali, Umesh Awasarmol, Girish Kapse, Shivam R Patil
Thermal design power (TDP) of microprocessor is the maximum theoretical amount of power in Watts that a processor may consume and therefore dissipate as heat. TDP is a very important from the point of view of cooling requirements of processor to secure a desired life and reliability. The value of TDP mentioned in the specification of the processor is always absolute maximum. Each model of microprocessor will have a thermal profile that gives a specific thermal resistance in K/W in terms of Tj which is maximum permitted temperature at the interface between die and heat spreader to achieve the specified maximum output, Tamb, which is maximum permitted ambient temperature to achieve the specified output and TDP which is maximum thermal design power rating of the microprocessor chip. Therefore, maximum achievable thermal resistance in K/W is estimated by taking the ratio of temperature difference of (Tj-Tamb) in K to TDP in Watt. According to International Technology Roadmap for Semiconductors (ITRS) projections for long-term projected values for the years 2003–2016 for both cost performance and high performance segments and different important parameters are given as follows (Gurrum et al. 2004) (ITRS is a set of documents produced by a group of semiconductor industry experts, from 2016 onward ITRS was renamed as International Roadmap for Devices and Systems, IRDS): Cost performance segment (desktop personal computer):