China 
Africa 
Explore chapters and articles related to this topic
Interconnection Technologies
Published in Fred W. Kear, Hybrid Assemblies and Multichip Modules, 2020
Soldering technology, as used by the electronics industry, has taken on a complex nature. Electronic soldering was first implemented through the use of hand soldering irons and wire solder, which contains a rosin flux core. Solder alloys were usually 60% tin and 40% lead or eutectic (63% tin and 37% lead). Using these alloys allowed the tin/lead mixture to melt at near the lowest possible temperature. (The solder alloy actually goes through a plastic stage, as its temperature increases, if the metal ratio is not eutectic.) The rosin core in this wire solder was available in a choice of active states so that the fluxing activity could be tailored to the soldering process. In this stage of its development, soldering technology was greatly enhanced by the knowledge gained in studying its scientific basis. Hand soldering is still much the same as it was during the early stages of electronic assembly technology. Of course, we know much more about the metallurgy of soldering and we understand much better how to control heat and other factors to achieve a good solder joint.
COLD WATER AND SUPPLY SYSTEMS
Published in Fred Hall, Roger Greeno, Building Services Handbook, 2011
Copper pipes may be jointed by bronze welding. Non-manipulative compression joints are used on pipework above ground and manipulative compression joints are used on underground pipework. The latter are specifically designed to prevent pipes pulling out of the joint. Push-fit joints are made from polybutylene. These provide simplicity of use and savings in time. Capillary joints have an integral ring of soft solder. After cleaning the pipe and fitting with wire wool and fluxing, heat application enables the solder to flow and form a joint. Solder alloy for drinking water supplies must be lead free, i.e. copper and tin. The Talbot joint is a push-fit joint for polythene pipes. A brass ferrule or support sleeve in the end of the pipe retains the pipe shape. Threaded joints on steel pipes are sealed by non-toxic jointing paste and hemp or polytetrafluorethylene (PTFE) tape. A taper thread on the pipe will help to ensure a water-tight joint. Union joints permit slight deflection without leakage. Lead pipes are no longer acceptable due to the risk of poisoning.
Second and Third Level Packaging Considerations for the use of Electronic Hardware at Elevated Temperatures
Published in F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak, High Temperature Electronics, 2018
F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak
High lead-content tin-containing solders offer a high operating temperature interconnect alternative. Although the composition is outside the eutectic, the two-phase temperature band is small. The high lead-content 95Pb-5Sn solder alloy has a melting point of 300°C. This alloy has found extensive use as a first-level solder interconnect for flip-chip applications joining chips to chip carriers. Other alloys similar to the 95Pb-5Sn alloy have similar properties, 95.5Pb-1 Sn-1.5Ag was developed to minimize intermetallic growth on silver metallizations, also has a high melting point of 309°C [Bader 1975]. These alloys consist of a matrix of large lead grains with small precipitates of tin in the bulk of the solder joint.
Design and prediction of healing assessment for AA2014-Nitinol strip-Solder alloy based hybrid self-healing composite structure via Taguchi analysis and fuzzy logic approach
Published in Mechanics of Advanced Materials and Structures, 2023
Vaibhav Srivastava, Manish Gupta
An aluminum alloy AA2014 is used as a matrix which has been reinforced with Ni-Ti (wt.% 55–45) based SMA (i.e. nitinol) strip of thickness of 1 mm and Sn45-Pb55 based solder alloy both as a healing agent to form a hybrid Metal Matrix Composites (MMC’s). The transition temperature of the phase transformation (i.e. Martensite to Austenite phase) for SMA strip is 70 °C. Whereas, the melting point of the solder alloy is 181 °C. The chemical composition of the AA2014 matrix confirmed through Energy Dispersion X-Ray (EDX) technique is shown in Table 1.