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Fabrication of BioMEMS Devices
Published in Simona Badilescu, Muthukumaran Packirisamy, BioMEMS, 2016
Simona Badilescu, Muthukumaran Packirisamy
Wafer-to-wafer bonding can also be carried out by using intermediate layers such as Au thin films (eutectic bonding), glass-frit bonding, solder bonding, etc. Other bonding methods, such as thermal pressure bonding, solvent bonding, ultrasonic welding, etc., are also used for joining polymer parts. The bonded of materials can be characterized by several methods. Nondestructive techniques that can be used to monitor the bonding process include infrared transmission, ultrasonic, and x-ray topography.
Fabrication Processes
Published in Manas Chanda, Plastics Technology Handbook, 2017
Table 2.12 gives a list of typical solvents selected as useful for cementing of plastics. A key to selection of solvents in this table is how fast they evaporate: a fast-evaporating solvent may not last long enough for some assemblies, while evaporation that is too slow could hold up production. It may be noted that solvent bonding of dissimilar materials is possible were the materials can be bonded with the same solvents (see Table 2.12).
Window Utilization, Magnet Wire and Insulation
Published in Colonel Wm. T. McLyman, Transformer and Inductor Design Handbook, 2017
Solvent Bonding is a method where the solvent activates the bonding material. This can be done, by passing the wire through a solvent-saturated felt pad or a light spray application. There are many activating solvents that can be used: denatured ethyl alcohol, isopropyl alcohol, methylethylketone and acetone. The solvents should always be checked on with the manufacturer for the latest in materials and for application notes.
A study on additive manufacturing build parameters as bonded joint design factors
Published in The Journal of Adhesion, 2021
L. Bergonzi, A. Pirondi, F. Moroni, M. Frascio, M. Avalle
Therefore, one of the next challenges of DfAM is the definitions of the methods to assemble the AM components together or on a main structure.[6] One of the first investigations on selecting suitable techniques for joining AM components was carried out by Espalin et al.,[7] in which methods were sorted in order of effectiveness with respect to the strength of the joint: hot air welding, ultrasonic spot welding, solvent and adhesive bonding. Adhesive and solvent bonding methods were therefore suggested when one values aesthetic results and is not concerned with mechanical property performance. However, adhesive bonding can be performed without heating, that was proven to have a detrimental effect on the dimensional accuracy of the AM components[8] especially if materials to be joined shows different coefficients of thermal expansion.
Impact properties of thermoplastic composites
Published in Textile Progress, 2018
Ganesh Jogur, Ashraf Nawaz Khan, Apurba Das, Puneet Mahajan, R. Alagirusamy
Amorphous thermoplastic polymers are characterized by the random orientation of the polymer molecules in their structure; the most-commonly utilized amorphous thermoplastic resins include polysulfones, polyamide-imides, polyphenylene sulfones, polyphenylene sulphide sulfones, polyethersulfones, polystyrene, polyetherimides, and polyacrylates. These polymers do have higher temperature stability over semi-crystalline polymers some of which is attributable to their higher glass transition temperatures (above 260 °C). Processing of these polymers is much simpler compared to their semi-crystalline counterparts as they have low melt viscosity, low crystalline structure, and less shrinkage. However, these resins exhibit lower creep and solvent resistance and poor property retention once the glass transition temperature is exceeded. Additionally, these polymeric resins need to be dried before processing as they are hygroscopic in nature (necessary because the presence of moisture leads to the formation of voids in the composite structure). Any of the component-joining techniques mentioned for the semi-crystalline polymers can be used for the amorphous polymers and also, the solvent-bonding technique which cannot be used for many semi-crystalline thermoplastics, can be used to join parts in the case of amorphous thermoplastics.